BONDED STRUCTURE AND METHOD FOR PRODUCING SAME

    公开(公告)号:US20210332267A1

    公开(公告)日:2021-10-28

    申请号:US17369743

    申请日:2021-07-07

    Abstract: A bonded structure has a first substrate composed of aluminum or an aluminum alloy, a first thin film layer formed on the surface of the first substrate, and a resin adhesive layer bonded to the surface of the first thin film layer. The first thin film layer is composed of silicate glass that has a metal element with different valency from Si as a solid solution. The resin adhesive layer includes a resin including a structural site derived from ionic polymerization or a resin capable of dehydration condensation.

    BONDED STRUCTURE
    2.
    发明申请

    公开(公告)号:US20230098430A1

    公开(公告)日:2023-03-30

    申请号:US17948318

    申请日:2022-09-20

    Abstract: A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.

    STRUCTURE
    3.
    发明申请

    公开(公告)号:US20220340797A1

    公开(公告)日:2022-10-27

    申请号:US17859448

    申请日:2022-07-07

    Inventor: Masami SAITO

    Abstract: A structure includes an aluminum base and an adhesive layer that is made of an adhesive resin adhering to a surface of the aluminum base. The adhesive layer includes a hard layer that abuts against an adhesive interface where the hard layer is adhered to the aluminum base, and a body layer that abuts against the hard layer. The hard layer is harder than the body layer.

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