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公开(公告)号:US20230098430A1
公开(公告)日:2023-03-30
申请号:US17948318
申请日:2022-09-20
Applicant: DENSO CORPORATION
Inventor: Hirotaka MIYANO , Masami SAITO , Kazuhiro MORITA , Taiga HANDA , Katsuhito MORI , Kunio MORI
IPC: C09J5/04
Abstract: A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.
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公开(公告)号:US20210138763A1
公开(公告)日:2021-05-13
申请号:US17150057
申请日:2021-01-15
Applicant: DENSO CORPORATION
Inventor: Masami SAITO , Koji KONDO , Masashi TOTOKAWA , Hirotaka MIYANO , Yoshitake SUGANUMA , Kenichi YAGI , Yuichi KATO , Kunio MORI , Katsuhito MORI , Taiga HANDA
Abstract: A bonded structure has a first bonded member with a first bonding surface, a second bonded member with a second bonding surface, and a bonding resin layer containing a polymer, disposed between the first bonding surface and the second bonding surface. The polymer in the bonding resin layer has polymer main chains oriented in an intersecting direction that intersects with the first bonding surface and the second bonding surface. The intersecting direction preferably extends along the thickness direction of the bonding resin layer. A heat exchanger has the bonded structure, and the first bonded member serves as a tubular member, and the second bonded member serves as a heat dissipation fin.
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