公开(公告)号：US20160307953A1

公开(公告)日：2016-10-20

申请号：US15130152

申请日：2016-04-15

Applicant: DENSO CORPORATION

Inventor： Keijiro Kono ,  Nobuhisa Shimizu ,  Mitsuru Nakamura

IPC: H01L27/146 ,  B60R11/04

CPC classification number: B60R11/04 ,  B60R2011/0026 ,  G06K9/00798 ,  G06K9/00832 ,  H01L27/14618 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257

Abstract: In an imaging device, an image-sensor board is housed in a metallic case, and includes first and second regions. The first region includes first conductor patterns and first insulators constituting a multilayer structure, a first outermost surface on which an image sensor is mounted, and a second outermost surface. The second region includes second conductor patterns and second insulators constituting a multilayer structure. A control circuit board is electrically connected to the first conductor patterns via the second outermost surface. A thermal transfer member is disposed to be in contact with the second region of the image-sensor board for transferring heat generated from the image sensor to the case. The second conductor patterns in the second region include a closest conductor pattern located closest to the thermal transfer member. The closest conductor pattern is electrically isolated from the first conductor patterns.

Abstract translation: 在成像装置中，图像传感器板容纳在金属壳体中，并且包括第一和第二区域。 第一区域包括构成多层结构的第一导体图案和第一绝缘体，安装有图像传感器的第一最外表面和第二最外表面。 第二区域包括构成多层结构的第二导体图案和第二绝缘体。 控制电路板经由第二最外表面与第一导体图形电连接。 热传递构件设置成与图像传感器板的第二区域接触，用于将从图像传感器产生的热量传送到壳体。 第二区域中的第二导体图案包括位于最靠近热转印构件的最接近的导体图案。 最接近的导体图案与第一导体图形电绝缘。

公开(公告)号：US09669772B2

公开(公告)日：2017-06-06

申请号：US15130152

申请日：2016-04-15

Applicant: DENSO CORPORATION

Inventor： Keijiro Kono ,  Nobuhisa Shimizu ,  Mitsuru Nakamura

IPC: H04N5/335 ,  H04N5/225 ,  B60R11/04 ,  H01L27/146 ,  G06K9/00 ,  B60R11/00

CPC classification number: B60R11/04 ,  B60R2011/0026 ,  G06K9/00798 ,  G06K9/00832 ,  H01L27/14618 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257

Abstract: In an imaging device, an image-sensor board is housed in a metallic case, and includes first and second regions. The first region includes first conductor patterns and first insulators constituting a multilayer structure, a first outermost surface on which an image sensor is mounted, and a second outermost surface. The second region includes second conductor patterns and second insulators constituting a multilayer structure. A control circuit board is electrically connected to the first conductor patterns via the second outermost surface. A thermal transfer member is disposed to be in contact with the second region of the image-sensor board for transferring heat generated from the image sensor to the case. The second conductor patterns in the second region include a closest conductor pattern located closest to the thermal transfer member. The closest conductor pattern is electrically isolated from the first conductor patterns.