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公开(公告)号：US20180148000A1
公开(公告)日：2018-05-31
申请号：US15824825
申请日：2017-11-28
Applicant: DENSO CORPORATION
Inventor： Mitsuru Nakamura , Nobuhisa Shimizu
CPC classification number: B60R11/04 , B60R2011/0026 , H04N5/2252 , H04N5/22521 , H04N5/2253 , H04N5/2254 , H04N5/23229
Abstract: In an imaging apparatus for mounting to a windshield of a vehicle, a cover includes a bottom wall arranged to cover the opening bottom wall of a camera-module case member and the opening bottom wall of a board case member, and a rear wall arranged to cover the opening rear wall of the camera-module case member. At least one of the bottom wall and the rear wall has fastening portions at which the case and the cover are closely fastened to each other. The fastening portions include at least first and second adjacent fastening portions having an interval therebetween. The interval is set to be equal to or less than half of a wavelength of a signal having a predetermined maximum frequency. The signal having the maximum frequency is used by at least one device installable in the vehicle or the signal is expected to be received by the processing board as noise.
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公开(公告)号：US20160307953A1
公开(公告)日：2016-10-20
申请号：US15130152
申请日：2016-04-15
Applicant: DENSO CORPORATION
Inventor： Keijiro Kono , Nobuhisa Shimizu , Mitsuru Nakamura
IPC: H01L27/146 , B60R11/04
CPC classification number: B60R11/04 , B60R2011/0026 , G06K9/00798 , G06K9/00832 , H01L27/14618 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2257
Abstract: In an imaging device, an image-sensor board is housed in a metallic case, and includes first and second regions. The first region includes first conductor patterns and first insulators constituting a multilayer structure, a first outermost surface on which an image sensor is mounted, and a second outermost surface. The second region includes second conductor patterns and second insulators constituting a multilayer structure. A control circuit board is electrically connected to the first conductor patterns via the second outermost surface. A thermal transfer member is disposed to be in contact with the second region of the image-sensor board for transferring heat generated from the image sensor to the case. The second conductor patterns in the second region include a closest conductor pattern located closest to the thermal transfer member. The closest conductor pattern is electrically isolated from the first conductor patterns.
Abstract translation: 在成像装置中，图像传感器板容纳在金属壳体中，并且包括第一和第二区域。 第一区域包括构成多层结构的第一导体图案和第一绝缘体，安装有图像传感器的第一最外表面和第二最外表面。 第二区域包括构成多层结构的第二导体图案和第二绝缘体。 控制电路板经由第二最外表面与第一导体图形电连接。 热传递构件设置成与图像传感器板的第二区域接触，用于将从图像传感器产生的热量传送到壳体。 第二区域中的第二导体图案包括位于最靠近热转印构件的最接近的导体图案。 最接近的导体图案与第一导体图形电绝缘。
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公开(公告)号：US10829062B2
公开(公告)日：2020-11-10
申请号：US16251530
申请日：2019-01-18
Applicant: DENSO CORPORATION
Inventor： Mitsuru Nakamura
IPC: B60R16/023 , H04L29/08 , B60R11/04 , G06F13/42
Abstract: An in-vehicle communication system includes communication lines connecting ECUs together in the form of a daisy chain, has a maximum transferable data length of 64 bytes or more, and selects a speed of data transfer from one of a plurality of transmission speeds more than or equal to 2 Mbps. Each ECU includes a substrate-side connector with surface-mounted connector pins. The connector pins include a first connector pin pair and a second connector pin pair. The first connector pin pair has leads whose lengths equal to each other. The second connector pin pair has leads whose lengths are equal to each other and different from those of the second connector pin pair. This minimizes the distortion of waveform of signals when the signals are transmitted at a speed higher than that in a high-speed CAN, thereby enables the number of nodes to be increased.
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公开(公告)号：US09669772B2
公开(公告)日：2017-06-06
申请号：US15130152
申请日：2016-04-15
Applicant: DENSO CORPORATION
Inventor： Keijiro Kono , Nobuhisa Shimizu , Mitsuru Nakamura
CPC classification number: B60R11/04 , B60R2011/0026 , G06K9/00798 , G06K9/00832 , H01L27/14618 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2257
Abstract: In an imaging device, an image-sensor board is housed in a metallic case, and includes first and second regions. The first region includes first conductor patterns and first insulators constituting a multilayer structure, a first outermost surface on which an image sensor is mounted, and a second outermost surface. The second region includes second conductor patterns and second insulators constituting a multilayer structure. A control circuit board is electrically connected to the first conductor patterns via the second outermost surface. A thermal transfer member is disposed to be in contact with the second region of the image-sensor board for transferring heat generated from the image sensor to the case. The second conductor patterns in the second region include a closest conductor pattern located closest to the thermal transfer member. The closest conductor pattern is electrically isolated from the first conductor patterns.
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