公开(公告)号：US20230364969A1

公开(公告)日：2023-11-16

申请号：US18356355

申请日：2023-07-21

Applicant: DENSO CORPORATION

Inventor： Takahiro MAEDA ,  Shota TERACHI ,  Kenshiro MATSUI ,  Takeshi YOSHINORI ,  Shinya KASAMATSU

IPC: B60H1/00 ,  B60H1/14

CPC classification number: B60H1/00921 ,  B60H1/00278 ,  B60H1/143 ,  B60H2001/00928 ,  B60H2001/00307

Abstract: A thermal management system includes refrigeration cycle equipment and a heating medium circuit. The heating medium circuit includes a high-temperature-side circuit connecting with the heating medium channel of the high-temperature-side water-refrigerant heat exchange portion, a low-temperature-side circuit connecting with a heating medium channel of a low-temperature-side water-refrigerant heat exchange portion, and a heat transfer portion connecting the high-temperature-side circuit and the low-temperature-side circuit. The low-temperature-side circuit includes a first heat exchange portion, a second heat exchange portion, a heating medium bypass channel, and a low-temperature-side circuit switching portion. While the heat transfer portion is transferring heat, the low-temperature-side circuit switching portion switches a circuit configuration of the low-temperature-side circuit to a circuit configuration that circulates the heating medium between the first heat exchange portion and the heating medium bypass channel.