-
公开(公告)号:US20190198954A1
公开(公告)日:2019-06-27
申请号:US16293844
申请日:2019-03-06
Applicant: DENSO CORPORATION
Inventor: Koji MIURA , Yasumitsu OMI , Masayuki TAKEUCHI , Takeshi YOSHINORI , Takashi YAMANAKA , Yoshiki KATO
IPC: H01M10/6569 , B60K11/02 , F28D15/06 , H01M10/613 , H01M10/615 , H01M10/625 , H01M10/6556 , H01M10/6571 , H01M10/663
CPC classification number: H01M10/6569 , B60K11/02 , F28D15/02 , F28D15/06 , H01M10/613 , H01M10/615 , H01M10/625 , H01M10/633 , H01M10/643 , H01M10/647 , H01M10/6556 , H01M10/6571 , H01M10/663 , H01M10/667 , H01M2220/20
Abstract: A device temperature regulator is provided with a device heat exchanger that functions as an evaporator at the time of cooling a temperature regulation target device and that functions as a heat radiator at the time of warming up the temperature regulation target device, and a condenser that condenses a gaseous working fluid. The device temperature regulator is provided with a heater that heats the working fluid collecting in a device fluid circuit, and a liquid amount regulator that regulates a liquid amount of the working fluid collecting in the device heat exchanger. The device heat exchanger includes a heat exchange portion that exchanges heat with the temperature regulation target device. The liquid amount regulator regulates the liquid amount of the liquid working fluid collecting in the device heat exchanger.
-
2.
公开(公告)号:US20190193213A1
公开(公告)日:2019-06-27
申请号:US16293877
申请日:2019-03-06
Applicant: DENSO CORPORATION
Inventor: Yasumitsu OMI , Takashi YAMANAKA , Yoshiki KATO , Takeshi YOSHINORI , Masayuki TAKEUCHI , Koji MIURA
CPC classification number: B23P15/26 , B23P2700/09 , F25B1/00 , F28D15/02 , F28D15/0283 , H05K7/20
Abstract: A method for manufacturing a device temperature controller includes filling an inside of a circuit with working fluid by connecting a filling port of the circuit to a container that stores gas phase working fluid. The circuit constitutes a thermosiphon heat pipe and allows the working fluid to circulate in the circuit. In the filling, the working fluid inside the circuit is cooled by a cooling source. An inside temperature of the circuit is decreased to be lower than an inside temperature of the container, and thereby an inside pressure of the circuit is decreased to be lower than an inside pressure of the container.
-
公开(公告)号:US20200259231A1
公开(公告)日:2020-08-13
申请号:US16842572
申请日:2020-04-07
Applicant: DENSO CORPORATION
Inventor: Yasumitsu OMI , Koji MIURA , Takeshi YOSHINORI , Masayuki TAKEUCHI
IPC: H01M10/6569 , H01M10/625 , H01M10/6552 , H01M10/613
Abstract: A cooling device for a vehicle is configured as a thermosiphon that performs heat transfer by a working fluid sealed in a sealed container to cool a target object. The cooling device includes an evaporator and an outdoor condenser. The evaporator forms a part of the sealed container, and evaporates the working fluid by absorbing heat of the target device. The outdoor condenser forms a part of the sealed container, and is disposed above the evaporator. The outdoor condenser is located adjacent to a cabin space with respect to a vehicle body around the cabin space. The outdoor condenser is fixed to the vehicle body or a member provided adjacent to the cabin space with respect to the vehicle body, and condenses the working fluid by radiating heat of the working fluid vaporized in the evaporator to an outside air.
-
公开(公告)号:US20200096260A1
公开(公告)日:2020-03-26
申请号:US16371195
申请日:2019-04-01
Applicant: DENSO CORPORATION
Inventor: Yasumitsu OMI , Takeshi YOSHINORI , Masayuki TAKEUCHI , Koji MIURA
IPC: F28D15/02
Abstract: An evaporator evaporates a working fluid by heat from a battery. The evaporator includes at least one evaporation channel connected to the battery in a thermally conductive manner. The evaporator includes a supply channel connected to an upstream end of the evaporation channel, and supplies the working fluid in liquid phase from the supply channel to the evaporation channel. The evaporator includes an outflow channel connected with a downstream end of the evaporation channel, and discharges the working fluid. The outflow channel is disposed above the supply channel, and the supply channel is disposed at a position more insulated from the heat of the battery than the evaporation channel is.
-
公开(公告)号:US20190190102A1
公开(公告)日:2019-06-20
申请号:US16285275
申请日:2019-02-26
Applicant: DENSO CORPORATION
Inventor: Koji MIURA , Takashi YAMANAKA , Yasumitsu OMI , Yoshiki KATO , Masayuki TAKEUCHI , Takeshi YOSHINORI
IPC: H01M10/6569 , F28D15/06 , H01M10/613 , H01M10/625 , H01M10/633 , H01M10/6552 , B60L58/26
CPC classification number: H01M10/6569 , B60K6/28 , B60L58/26 , B60Y2200/91 , B60Y2200/92 , B60Y2306/05 , B60Y2400/112 , F28D15/02 , F28D15/06 , H01M10/613 , H01M10/625 , H01M10/633 , H01M10/6552 , H01M10/6556 , H01M2220/20 , H05K7/20
Abstract: A device temperature regulator is provided with a gas passage part that guides a gaseous working fluid evaporated in a device heat exchanger to a condenser, and a liquid passage part that guides a liquid working fluid condensed in the condenser to the device heat exchanger. The device temperature regulator is provided with a supply amount regulator that increases or decreases a supply amount of the liquid working fluid supplied to the device heat exchanger. The supply amount regulator decreases the supply amount of the liquid working fluid to the device heat exchanger such that a liquid surface is formed in a state where the gaseous working fluid is positioned at a lower side lower than a heat exchanging portion exchanging heat with a temperature regulation target device in the device heat exchanger, when a condition for keeping the temperature regulation target device at a temperature is satisfied.
-
公开(公告)号:US20210280925A1
公开(公告)日:2021-09-09
申请号:US16330440
申请日:2017-08-02
Applicant: DENSO CORPORATION
Inventor: Takeshi YOSHINORI , Takashi YAMANAKA , Yoshiki KATO , Masayuki TAKEUCHI , Koji MIURA , Yasumitsu OMI
IPC: H01M10/625 , H01M10/63 , H01M10/613 , H01M10/615 , H01M10/6564 , H01M10/6568
Abstract: In a device temperature regulator, an evaporator cools a target device by a latent heat of evaporation of a working fluid that absorbs heat from the target device and is evaporated. A first condenser includes a first heat exchange passage that condenses the working fluid evaporated in the evaporator by a heat exchange with an outside first medium. A second condenser includes a second heat exchange passage that condenses the working fluid evaporated in the evaporator by a heat exchange with an outside second medium. A gas-phase passage causes the working fluid evaporated in the evaporator to flow to the first condenser and the second condenser. Furthermore, a first liquid-phase passage causes the working fluid condensed in the first condenser to flow to the evaporator, and a second liquid-phase passage causes the working fluid condensed in the second condenser to flow to the evaporator.
-
公开(公告)号:US20200338963A1
公开(公告)日:2020-10-29
申请号:US16852549
申请日:2020-04-20
Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA , DENSO CORPORATION
Inventor: Yusuke SUZUKI , Yoshiyuki YAMASHITA , Takeshi YOSHINORI , Yasumitsu OMI , Koji MIURA
IPC: B60H1/32 , B60K11/02 , F28D15/02 , H01M10/613 , H01M10/625 , H01M10/6556 , H01M10/6569
Abstract: A cooling device includes: an evaporator cooling a cooling object by evaporating a heat medium in a liquid phase by a heat exchange between the cooling object and the heat medium; a condenser, disposed above the evaporator, radiating a heat of the heat medium to an external fluid by condensing the heat medium in a gas phase by a heat exchange between the heat medium and the external fluid; a gas-phase passage for guiding the gas-phase heat medium from the evaporator to the condenser; and a liquid-phase passage for guiding the liquid-phase heat medium from the condenser to the evaporator. Further, the gas-phase passage includes a rising portion on one side of the cooling device in a predetermined direction orthogonal to a vertical direction and at least a part of the rising portion rises above surroundings.
-
公开(公告)号:US20200254845A1
公开(公告)日:2020-08-13
申请号:US16861044
申请日:2020-04-28
Applicant: DENSO CORPORATION
Inventor: Koji MIURA , Yasumitsu OMI , Takeshi YOSHINORI , Masayuki TAKEUCHI
IPC: B60H1/00 , H01M10/613 , H01M10/625 , H01M10/6556 , H01M10/6568 , H01M10/635 , H01M10/6561
Abstract: A cooler cools a target equipment by evaporation latent heat of working fluid. A cold-heat heat exchanger condenses the working fluid by radiating heat of the working fluid using cold heat of low-temperature and low-pressure refrigerant circulating in a refrigeration cycle. An air-cooled heat exchanger condenses the working fluid by radiating heat of the working fluid using cold heat of outside air. The cooler, the cold-heat heat exchanger, and the air-cooled heat exchanger are connected by a gas pipe and a liquid pipe. An outside air temperature detector detects an outside air temperature. A saturation temperature detector detects a saturation temperature of the working fluid circulating in a thermosiphon circuit. A heat radiation controller controls an amount of heat radiated from the working fluid flowing through the cold-heat heat exchanger so that the saturation temperature of the working fluid becomes higher than the outside air temperature.
-
公开(公告)号:US20190214695A1
公开(公告)日:2019-07-11
申请号:US16351738
申请日:2019-03-13
Applicant: DENSO CORPORATION
Inventor: Koji MIURA , Yasumitsu OMI , Takeshi YOSHINORI , Masayuki TAKEUCHI , Takashi YAMANAKA , Yoshiki KATO
IPC: H01M10/6569 , F28D15/02 , H01M10/613 , H01M10/625 , H01M10/6556
CPC classification number: H01M10/6569 , B60K1/04 , B60K6/28 , B60K2001/005 , B60L58/26 , B60Y2200/91 , B60Y2200/92 , F28D15/02 , F28D15/025 , H01M10/613 , H01M10/617 , H01M10/625 , H01M10/6556 , H01M2220/20
Abstract: A device temperature controller includes a heat absorber that absorbs heat from a temperature control target device to evaporate working fluid in liquid phase, and a condenser disposed above the heat absorber to condense the working fluid which has been evaporated into gas phase at the heat absorber. The device temperature controller includes a gas passage portion that guides the working fluid which has been evaporated into gas phase at the heat absorber to the condenser, and a liquid passage portion that guides the working fluid which has been condensed into liquid phase at the condenser to the heat absorber. At least a part of the gas passage portion and at least a part of the liquid passage portion are in contact with each other.
-
公开(公告)号:US20190184852A1
公开(公告)日:2019-06-20
申请号:US16285302
申请日:2019-02-26
Applicant: DENSO CORPORATION
Inventor: Masayuki TAKEUCHI , Yasumitsu OMI , Takashi YAMANAKA , Yoshiki KATO , Takeshi YOSHINORI , Koji MIURA
IPC: B60L58/26 , F28D15/06 , B60H1/32 , B60H1/00 , H01M10/613 , H01M10/663 , H01M10/625 , H01M10/6552 , B60L50/60
CPC classification number: B60L58/26 , B60H1/00 , B60H1/00278 , B60H1/32 , B60H1/3205 , B60L50/50 , B60L50/66 , B60Y2200/91 , B60Y2306/05 , F28D15/02 , F28D15/06 , H01M10/613 , H01M10/625 , H01M10/6552 , H01M10/663 , H01M2220/20 , Y02T10/7005 , Y02T10/7022
Abstract: A device temperature adjusting apparatus in which working fluid circulates is mounted on a vehicle and controls a temperature of a target device. The device temperature adjusting apparatus includes a heat absorbing portion that evaporates the working fluid by causing the working fluid to absorb heat from the target device, and a heat releasing portion condenses the working fluid by causing heat release from the working fluid. The device temperature adjusting apparatus includes a forward path portion that defines a forward flow passage and a return path portion. The heat releasing portion is disposed in an inside air circulation path through which inside air circulates while vehicle interior air conditioning is performed by an air conditioning unit that blows out temperature-controlled air to an interior of the vehicle.
-
-
-
-
-
-
-
-
-