公开(公告)号：US20250046669A1

公开(公告)日：2025-02-06

申请号：US18921484

申请日：2024-10-21

Applicant: DENSO CORPORATION

Inventor： Takuya Mitsuhashi ,  Kimio Kohara ,  Yoichiro Kawamoto

IPC: H01L23/367 ,  H01L23/373

Abstract: An electronic component with heat dissipating part includes: an electronic part, a heat radiating part, and a joining member. The electronic part generates heat during operation. The heat radiating part radiates heat generated by the electronic part to an ambient fluid. The joining member joins the electronic part and the heat radiating part. A joint area between the electronic part and the heat radiating part is 100 mm2 or more. The joining member forms a porous metal layer in which pores are uniformly distributed throughout.

公开(公告)号：US12078433B2

公开(公告)日：2024-09-03

申请号：US17578922

申请日：2022-01-19

Applicant: DENSO CORPORATION

Inventor： Takefumi Hosono ,  Kimio Kohara

IPC: F28F3/08 ,  F25B41/30

CPC classification number: F28F3/086 ,  F25B41/30 ,  F25B2400/21

Abstract: A heat releasing unit includes heat releasing constituents which are stacked and are joined together while heat releasing flow passages are formed in the heat releasing constituents, respectively. An evaporating unit includes evaporating constituents which are stacked and are joined together, while evaporating flow passages are formed in the evaporating constituents, respectively. The evaporating unit and the heat releasing unit are arranged one after another in a direction along a side plate portion. A heat releasing unit outlet is formed at an outlet-side heat releasing constituent that is one of the heat releasing constituents placed at an end thereof. An evaporating unit inlet is formed at an inlet-side evaporating constituent that is one of the evaporating constituents placed at an end thereof. All of the heat releasing flow passages are connected to the evaporating flow passages through the heat releasing unit outlet and the evaporating unit inlet.

公开(公告)号：US11035629B2

公开(公告)日：2021-06-15

申请号：US16207366

申请日：2018-12-03

Applicant: DENSO CORPORATION

Inventor： Yousuke Goto ,  Kimio Kohara ,  Satoshi Sakimichi ,  Shogo Kawaguchi

IPC: F28F27/02 ,  F28F13/10 ,  F28F9/02

Abstract: A heat exchange apparatus includes a heat exchanger through which a heat exchange medium flows inside, a fluid transport device that causes the heat exchange medium to flow, and a flow path through which the heat exchange medium flows. The heat exchange apparatus includes a flow rate controller configured to increase or decrease the flow rate of the heat exchange medium flowing through the flow path, and a driving part that drives the flow rate controller by receiving a force from the flow of the heat exchange medium flowing through the flow path.