公开(公告)号：US20220244296A1

公开(公告)日：2022-08-04

申请号：US17724555

申请日：2022-04-20

Applicant: DENSO CORPORATION

Inventor： Satoshi YAMAURA

IPC: G01R15/20 ,  H02M7/5387

Abstract: A sensor unit includes a first connection bus bar to a seventh connection bus bar connected to switch modules. The sensor unit includes a base integrally molding the first connection bus bar to the seventh connection bus bar. The sensor unit includes a plurality of magnetic-electric conversion units which detects current of the first connection bus bar to the seventh connection bus bar, respectively. The sensor unit includes a nut box connected to the base. The base and the nut box extends in the x-direction. A plurality of pillars, which are separated each other in the x-direction, are formed on the base. The nut box is fixed to the plurality of pillars by fixing bolts.

公开(公告)号：US20200161213A1

公开(公告)日：2020-05-21

申请号：US16574134

申请日：2019-09-18

Applicant: DENSO CORPORATION

Inventor： Satoshi YAMAURA

IPC: H01L23/433 ,  H01L25/07 ,  H01L23/427

Abstract: The waterproof casing has a housing and a grommet. The grommet is disposed in a hole of the housing. The grommet has a body, a flange, and a lip. The flange extends radially outward from the body. The lip protrudes from an outer peripheral part of the body and extends in a circumferential direction. The lip has a high compression portion in contact with a wall surface of the hole and a low compression portion adjacent to the high compression portion at a further side from the flange. The low compression portion has a lower compressed state than the high compression portion. The housing has a recess to allow the low compression portion to escape radially outward.

公开(公告)号：US20200020609A1

公开(公告)日：2020-01-16

申请号：US16507185

申请日：2019-07-10

Applicant: DENSO CORPORATION

Inventor： Satoshi YAMAURA ,  Keisuke MIZUSHIRI

IPC: H01L23/473 ,  H01L23/50 ,  H01L25/07 ,  H02M7/00

Abstract: A power conversion apparatus includes a plurality of semiconductor modules each having a semiconductor element integrated thereto; a plurality of cooling pipes that cools the semiconductor modules; a plurality of dummy modules with no integrated semiconductor element; and a pair of DC bus bars that constitute a current path between a DC power source and respective semiconductor modules. The semiconductor modules or the dummy modules, and the cooling pipes are alternately stacked to form a stack; m the plurality of semiconductor modules constitute an inverter circuit that converts a DC power supplied from the DC power source into a multi-phase AC power in which a plurality of types of AC outputs having mutually different phases are combined; and the dummy modules are each interposed between two semiconductor modules having mutually different phases of the AC outputs.

公开(公告)号：US20130121052A1

公开(公告)日：2013-05-16

申请号：US13672870

申请日：2012-11-09

Applicant: DENSO CORPORATION

Inventor： Satoshi YAMAURA

IPC: H02M7/537

CPC classification number: H02M7/537 ,  G06F1/20 ,  H01L23/473 ,  H01L2924/0002 ,  H02M7/003 ,  H02M7/162 ,  H01L2924/00

Abstract: In an electric power converter, a stacked-layer unit has a plurality of semiconductor modules arrayed as layers along a stacking direction, each semiconductor module containing a semiconductor element and a pair of power terminals protruding outward in a protrusion direction at right angles to the stacking direction, each pair consisting of an AC terminal and a positive-polarity or negative-polarity power terminal. The semiconductor modules are arranged with the positive-polarity and negative-polarity power terminals in a single column at one side of the stacked-layer unit, and respectively connected to a positive-polarity busbar and negative-polarity busbar which are located at that side and which are separated by a fixed spacing in the protrusion direction, while the AC terminals of each layer-adjacent pair of semiconductor modules are connected in common to a corresponding one of a plurality of AC busbars.

Abstract translation: 在电力转换器中，堆叠层单元具有沿堆叠方向排列成层的多个半导体模块，每个半导体模块包含半导体元件和一对电源端子，其突出方向与堆叠方向成直角突出 方向，每对由AC端子和正极性或负极性电力端子组成。 半导体模块的正极性和负极性电力端子被布置在堆叠层单元的一侧的单个列中，并且分别连接到位于该侧的正极母线和负极母线 并且在突出方向上以固定间隔分开，而每层相邻的一对半导体模块的AC端子共同连接到多个AC母线中的对应的一个。

公开(公告)号：US20240088013A1

公开(公告)日：2024-03-14

申请号：US18516110

申请日：2023-11-21

Applicant: DENSO CORPORATION

Inventor： Shintaro KOGURE ,  Satoshi YAMAURA

IPC: H01L23/50 ,  B60R16/023 ,  H01L23/473 ,  H01L25/11 ,  H02K3/50 ,  H02K9/19 ,  H02K11/27 ,  H02K11/33

CPC classification number: H01L23/50 ,  B60R16/0238 ,  H01L23/473 ,  H01L25/115 ,  H02K3/50 ,  H02K9/19 ,  H02K11/27 ,  H02K11/33 ,  H02K2203/09

Abstract: A power control apparatus includes a busbar unit which supports a plurality of busbars connected to a plurality of semiconductor modules. The busbar includes a first plate shaped portion and a second plate shaped portion. The first plate shaped portion is adjacent to a cooling device in a posture facing an internal passage of the cooling device in the plate thickness direction. The second plate shaped portion is placed in a posture in which a plate thickness direction thereof intersects with a plate thickness direction of the first plate shaped portion. The second plate shaped portion has outer surfaces including a side surface having a narrower width corresponding to a plate thickness. The second plate shaped portion is placed in a posture in which the side surface faces the semiconductor module.

公开(公告)号：US20190356234A1

公开(公告)日：2019-11-21

申请号：US16304117

申请日：2017-05-15

Applicant: DENSO CORPORATION

Inventor： Satoshi YAMAURA

IPC: H02M7/00 ,  H02M7/48

Abstract: A power conversion apparatus includes a plurality of semiconductor modules each with a power terminal protruding therefrom, a capacitor, and a pair of bus bars. The power terminals include a pair of DC terminals electrically connected to the capacitor via the bus bars, and an AC terminal. Each of the bus bars includes terminal connection portions welded to the respective DC terminals and a common portion electrically connected to the plurality of terminal connection portions. The common portions are arranged between the sets of the plurality of power terminals. An insulation member is interposed between the pair of common portions. High-thermal-resistance portions having a higher thermal resistance than the terminal connection portions are each formed between the corresponding terminal connection portion and the corresponding common portion.