公开(公告)号：US20240087978A1

公开(公告)日：2024-03-14

申请号：US18504487

申请日：2023-11-08

Applicant: DENSO CORPORATION

Inventor： Takanori KAWASHIMA ,  Tomomi OKUMURA ,  Shunsuke ARAI ,  Naruhiro INOUE

IPC: H01L23/373 ,  H01L23/00 ,  H01L23/31 ,  H01L25/07

CPC classification number: H01L23/3735 ,  H01L23/3142 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H02P27/06

Abstract: A semiconductor device includes semiconductor elements arranged in a first direction, an arm connection portion disposed between the semiconductor elements in the first direction, first and second power supply terminals disposed on the same side in the first direction, first and second substrates interposing the semiconductor elements therebetween, and a sealing body. The second substrate includes an insulating base member, a front-face metal body and a back-face metal body. The front-face metal body includes a second power supply wiring and a second relay wiring. The second power supply wiring includes a base portion on which the second element is arranged, and a pair of extending portions extending from the base portion in the first direction. The second relay wiring is disposed between the extending portions in a second direction, so that the second relay wiring and the base portion satisfy a relationship of L1

公开(公告)号：US20190333909A1

公开(公告)日：2019-10-31

申请号：US16507240

申请日：2019-07-10

Applicant: DENSO CORPORATION

Inventor： Satoru SUGITA ,  Ryota TANABE ,  Shunsuke ARAI

IPC: H01L25/18 ,  H01L29/417 ,  H01L23/31 ,  H01L23/473 ,  H01L23/367 ,  H02M7/537

Abstract: A semiconductor device includes a first semiconductor module and a second semiconductor module. The first semiconductor module configures an upper arm, and includes first semiconductor elements connected in parallel to each other, a sealing resin body, and a positive electrode terminal. The second semiconductor module configures a lower arm, and includes second semiconductor elements connected in parallel to each other, a sealing resin body, and a negative electrode terminal. The first and second semiconductor modules are aligned in an alignment direction. At least one of the first and second semiconductor modules has a relay terminal for electrically relaying electrodes on a low potential side of the first semiconductor elements and electrodes on a high potential side of the second semiconductor elements.

公开(公告)号：US20190088568A1

公开(公告)日：2019-03-21

申请号：US16088093

申请日：2017-04-27

Applicant: DENSO CORPORATION

Inventor： Hiroshi ISHINO ,  Hideki KAWAHARA ,  Shinji HIRAMITSU ,  Shunsuke ARAI

IPC: H01L23/36 ,  H01L25/07 ,  H02M7/48 ,  H01L23/00

Abstract: In a semiconductor device, a plurality of semiconductor chips included in an upper-arm circuit are connected in parallel between a pair of upper-arm plates, while a plurality of semiconductor chips included in a lower-arm circuit are connected in parallel between a pair of lower-arm plates. In each of the arm circuits, the plurality of semiconductor chips are arranged in a direction perpendicular to a direction in which emitter electrodes and pads are arranged, the pads are disposed on the same side of the emitter electrodes, and signal terminals extend in the same direction. A series-connecting part between the upper- and lower-arm circuits includes a joint part 20 continued to respective side surfaces of the corresponding upper- and lower-arm plates. Each of inductances of respective parallel-connecting parts of the upper- and lower-arm plates which connect the semiconductor chips in parallel is smaller than an inductance of the series-connecting part.