公开(公告)号：US10321611B2

公开(公告)日：2019-06-11

申请号：US15978507

申请日：2018-05-14

Applicant: DENSO CORPORATION

Inventor： Naoki Hirasawa ,  Ryota Tanabe ,  Taijiro Momose ,  Hiromi Ichijo

IPC: H05K7/20 ,  H02M7/00 ,  H05K7/14 ,  H05K5/02

Abstract: A power conversion apparatus includes a semiconductor module, an electronic component, a cooling member, a casing and a pressurizing member. The electronic component includes a load application part that receives a load caused by pressurizing force on a surface in a pressurizing member side with respect to the lamination direction; a load supporting part that comes into contact with a contact part of the casing on a surface opposite to the pressurizing member side with respect to the lamination direction; and a fastening part fastened to a casing fastening part. The load supporting part is disposed between the load application part and the fastening part; moment of force around the load supporting part is produced in the electronic component by the load applied to the load application part; and the moment causes the electronic component to be pressed towards a pressed part of the casing.

公开(公告)号：US11239224B2

公开(公告)日：2022-02-01

申请号：US16785913

申请日：2020-02-10

Applicant: DENSO CORPORATION

Inventor： Kazuma Fukushima ,  Yuu Yamahira ,  Ryota Tanabe ,  Tetsuya Matsuoka ,  Kosuke Kamiya ,  Taijiro Momose

IPC: H05K1/14 ,  H01L25/18 ,  H01L23/50 ,  H02M7/00 ,  H02M3/158 ,  H02M7/5387 ,  H02P27/06

Abstract: A power conversion device provided with a switching circuit unit including a plurality of upper-arm switching elements connected to positive electrode wiring and a plurality of lower-arm switching elements connected to negative electrode wiring. The power conversion device includes a first semiconductor module incorporating a plurality of the upper-arm switching elements connected together in parallel, a second semiconductor module incorporating a plurality of the lower-arm switching elements connected together in parallel, and a third semiconductor module incorporating the upper-arm switching elements connected together in series and the lower-arm switching elements connected together in series.

公开(公告)号：US10554145B2

公开(公告)日：2020-02-04

申请号：US15990954

申请日：2018-05-29

Applicant: DENSO CORPORATION

Inventor： Naoki Hirasawa ,  Ryota Tanabe ,  Taijiro Momose

IPC: H02M7/00 ,  H02M7/537 ,  H02M3/158 ,  H02B1/20 ,  H01G4/228 ,  H01G4/38 ,  H02G5/00 ,  H01G4/40 ,  H01L23/64 ,  H01L29/739

Abstract: An electrical power conversion apparatus includes a high-voltage bus bar, a low-voltage bus bar, and a relay bus bar which are integrated together in the form of a bus bar assembly. The high-voltage bus bar includes semiconductor-side high-voltage terminals and capacitor-side high-voltage terminals. The low-voltage bus bar includes semiconductor-side low-voltage terminals and capacitor-side low-voltage terminals. The relay bus bar includes a reactor-side relay terminal and a capacitor-side relay terminal 532. The capacitor-side high-voltage terminals, the capacitor-side low-voltage terminals, and the capacitor-side relay terminal are arranged in the form of a terminal array. The capacitor-side high-voltage terminals and the capacitor-side low-voltage terminals are arranged adjacent each other. The capacitor-side relay terminal is located at an end of an array of the capacitor-side high-voltage terminals and the capacitor-side low-voltage terminals. With these arrangements, the electrical power conversion apparatus is capable of reducing the inductance and facilitating the assembling and downsizing thereof.

公开(公告)号：US10548246B2

公开(公告)日：2020-01-28

申请号：US16212857

申请日：2018-12-07

Applicant: DENSO CORPORATION

Inventor： Kazuya Takeuchi ,  Taijiro Momose

IPC: H05K7/20 ,  H05K5/00

Abstract: An electric power converter is provided which includes a stack body made of a stack of a plurality of electronic devices and cooling medium flow paths in which cooling medium flows. The electric power converter also includes a housing in which the stack body is disposed. The housing 3 has a stack facing wall which faces the stack body in a stacking direction. The stack facing wall has an in-wall flow path in which the cooling medium flows and which communicates the cooling medium flow paths. This structure enables the electric power converter to be reduced in size thereof.

公开(公告)号：US10410953B2

公开(公告)日：2019-09-10

申请号：US15654858

申请日：2017-07-20

Applicant: DENSO CORPORATION

Inventor： Taijiro Momose

IPC: H01L23/42 ,  H01L23/28 ,  H01L23/488 ,  H01L23/367 ,  H01L25/07

Abstract: A power conversion device includes a semiconductor module with switching elements incorporated therein, a plurality of components electrically connected to the semiconductor module, and a laminated cooler provided with a plurality of cooling plates. A laminate is constituted by laminating at least the plurality of cooling plates and the semiconductor module, at least one among the plurality of cooling plates constituting the laminate is a large area cooling plate in which a projected area when viewed from the stacking direction is larger than the other cooling plates, and at least one of the components is a specific arrangement component which, when viewed from the stacking direction, is arranged in a specific position which overlaps the large area cooling plate, and, when viewed from a direction orthogonal to the stacking direction, overlaps with the laminate.