Heat conduction device
    2.
    发明授权

    公开(公告)号:US11662161B2

    公开(公告)日:2023-05-30

    申请号:US16438630

    申请日:2019-06-12

    Abstract: A heat conduction device includes a heat source portion, a temperature control surface, and heat transfer portions. The heat source portion is configured to generate at least hot heat or cold heat. The temperature control surface is sectioned into a plurality of temperature control sections, and at least some of the plurality of temperature control sections are disposed away from the heat source portion. The plurality of heat transfer portions connect the heat source portion and the plurality of the temperature control sections to transfer heat between the heat source portion and the plurality of temperature control sections. The plurality of temperature control sections are separated from each other based on a distance from the heat source portion.

    Air discharge device
    3.
    发明授权

    公开(公告)号:US12103364B2

    公开(公告)日:2024-10-01

    申请号:US17064831

    申请日:2020-10-07

    CPC classification number: B60H1/3407 B60H1/3457 F24F13/072

    Abstract: An air discharge device includes a duct that defines a flow passage through which a working air flow to be discharged passes, and a hole forming member defining an air discharge hole as an outlet of the working air flow. The hole forming member has a vortex generation structure configured to generate an auxiliary vortex having a vortex characteristic including a vortex rotation direction and a vortex axis direction. The vortex characteristic of the auxiliary vortex is different from that of a lateral vortex generated by the working air flow at a downstream side of the air discharge hole. The vortex generation structure is configured in the hole forming member so that the auxiliary vortex collides with the lateral vortex in a state where at least one of the vortex rotation direction and the vortex axial direction of the vortex characteristic is different from that of the lateral vortex.

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