公开(公告)号：US20180098457A1

公开(公告)日：2018-04-05

申请号：US15718526

申请日：2017-09-28

Applicant: DENSO CORPORATION

Inventor： Kazuya TAKEUCHI ,  Naoki HIRASAWA ,  Hiromi ICHIJO ,  Shingo OONO ,  Takuya OIZUMI

IPC: H05K7/20 ,  H02M7/00 ,  H01L23/46

CPC classification number: H05K7/209 ,  H01L23/40 ,  H01L23/4012 ,  H01L23/46 ,  H01L23/473 ,  H02M3/158 ,  H02M7/003 ,  H02M7/5387 ,  H02M2001/007 ,  H02M2001/008 ,  H02M2001/327 ,  H05K7/20854 ,  H05K7/20927

Abstract: A power converter includes a stack of a plurality of semiconductor modules, each of which incorporates semiconductor elements, and a plurality of cooling conduits, though each of which a coolant flows to cool the semiconductor modules, at least one electronic component electrically connected to the semiconductor modules, and a cooling plate for cooling the at least one electronic component. The stack, the at least one electronic component, and the cooling plate are arranged in a stacking direction of the stack. The cooling plate is connected to the cooling conduits and has an intra-plate pathway formed therein thorough which the coolant flows in a direction perpendicular to the stacking direction. The cooling plate has a larger area than each cooling conduit when viewed from the stacking direction.