公开(公告)号：US20040187575A1

公开(公告)日：2004-09-30

申请号：US10771461

申请日：2004-02-05

Applicant: DENSO CORPORATION

Inventor： Minoru Murata ,  Toshiya Ikezawa ,  Tetsuro Yano

IPC: G01P015/00

CPC classification number: G01P15/125 ,  G01P2015/0814 ,  Y10S414/141

Abstract: A semiconductor dynamic sensor has a displacement portion, which is composed of a movable electrode and first and second fixed electrodes, formed in a semiconductor substrate. The movable electrode is displaced in response to applied acceleration, so that capacitance between the movable electrode and each of the first and second fixed electrodes changes. Therefore,the applied acceleration can be detected based on the capacitance change. A plurality of rectangular-shaped suction portions is provided at four corners on the surface of the semiconductor substrate. By sucking the suction portions using a collet check, the semiconductor dynamic sensor such can be transported without damaging the displacement portion.

Abstract translation: 半导体动态传感器具有形成在半导体衬底中的由可动电极和第一和第二固定电极组成的位移部分。 可移动电极响应于所施加的加速度而移位，使得可动电极与第一和第二固定电极中的每一个之间的电容发生变化。 因此，可以基于电容变化来检测所施加的加速度。 在半导体基板的表面的四个角设置有多个矩形的吸引部。 通过使用夹头检查吸引吸引部，可以输送半导体动态传感器而不损害位移部。