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公开(公告)号:US20190242925A1
公开(公告)日:2019-08-08
申请号:US16261752
申请日:2019-01-30
发明人: Alan Malvern
IPC分类号: G01P15/125 , G01P15/13 , G01P1/00
CPC分类号: G01P15/125 , B81B5/00 , G01P1/006 , G01P15/131 , G01P2015/0814
摘要: A method for controlling closed loop operation of a capacitive accelerometer comprises applying first in-phase and anti-phase PWM drive signals, respectively, to a first pair of fixed capacitive electrodes and applying second in-phase and anti-phase PWM drive signals, respectively, to a second pair of fixed capacitive electrodes. A displacement of a proof mass relative to fixed capacitive electrodes is sensed by measuring a pickoff signal from the proof mass and adjusting the mark-space ratio of the first and/or second PWM drive signals to provide a restoring force on the proof mass that balances an applied acceleration and maintains the proof mass at a null position. The first and second PWM drive signals applied to the first and second pairs of fixed capacitive electrodes are offset in time from one another by an offset period.
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公开(公告)号:US10012671B2
公开(公告)日:2018-07-03
申请号:US14931696
申请日:2015-11-03
发明人: Shih-Chieh Lin
IPC分类号: G01P15/125
CPC分类号: G01P15/125 , G01P15/18 , G01P21/00 , G01P2015/0814 , G01P2015/0831 , G01P2015/0868
摘要: A MEMS device includes: a substrate; a proof mass suspended over the substrate, the proof mass including at least one proof mass body and a proof mass frame connected to and accommodating the proof mass body, the proof mass frame including at least one self-test frame; and at least one self-test electrode inside the self-test frame, and connected to the substrate; wherein when a voltage difference is applied between the self-test electrode and the self-test frame, the proof mass is driven to have an in-plane movement, and wherein the self-test electrode and the self-test frame do not form a sensing capacitor in between.
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公开(公告)号:US09927459B2
公开(公告)日:2018-03-27
申请号:US14073160
申请日:2013-11-06
申请人: Analog Devices, Inc.
发明人: William A. Clark , Xin Zhang
IPC分类号: G01P15/125 , G01P21/00 , G01P15/08
CPC分类号: G01P15/125 , G01P21/00 , G01P2015/0814 , G01P2015/0868
摘要: An accelerometer has a movable mass suspended above a substrate, and a variable acceleration capacitor supported by the substrate. The movable mass has a mass anchor securing the mass to the substrate, while the acceleration capacitor has both a stationary finger extending from the substrate, and a movable finger extending from the movable mass. The accelerometer also has a variable stress capacitor, which also includes the stress finger, for determining movement of the mass anchor relative to the substrate.
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公开(公告)号:US09880000B2
公开(公告)日:2018-01-30
申请号:US14938268
申请日:2015-11-11
发明人: Teruo Takizawa , Atsuki Naruse , Shigekazu Takagi
IPC分类号: G01P15/00 , G01C19/5769 , G01C19/5712 , G01P15/125 , G01P15/08 , B81C1/00
CPC分类号: G01C19/5769 , B81B2201/025 , B81C1/00293 , B81C1/00301 , B81C2203/0145 , G01C19/5712 , G01P15/0802 , G01P15/125 , G01P2015/0814
摘要: A manufacturing method of an inertial sensor which includes a movable body that is disposed in a cavity formed by a base body and a lid, and in which a wiring groove of wiring communicating with the cavity and electrically connected to the movable body is formed in the base body, includes forming a first opening section, which does not penetrate through the lid by wet etching; accommodating the movable body in the cavity by bonding the base body and the lid; forming a first sealing material with which the wiring groove is sealed after the accommodating of the movable body; forming a through-hole communicating with the cavity by penetrating through the first opening section by dry etching after the forming of the first sealing material; and forming a second sealing material with which the through-hole is sealed.
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5.
公开(公告)号:US09772370B2
公开(公告)日:2017-09-26
申请号:US14666870
申请日:2015-03-24
IPC分类号: G01R31/28 , G05F1/10 , G01P15/125 , G01P21/00 , G01P15/08
CPC分类号: G01R31/28 , G01P15/125 , G01P21/00 , G01P2015/0814 , G05F1/10 , Y10T307/664
摘要: A physical quantity detecting sensor includes a physical quantity detecting sensor element and an IC connected to the physical quantity detecting sensor element. The IC includes: a logic circuit; an analog circuit; a first regulator that supplies a logic power supply voltage generated based on a power supply voltage to the logic circuit; a second regulator that is switched to enable or disable and supplies an analog power supply voltage, which is generated based on the power supply voltage when the second regulator is set to enable, to the analog circuit; and a switch for supplying the logic power supply voltage to the analog circuit when the second regulator is set to disable.
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公开(公告)号:US09764940B2
公开(公告)日:2017-09-19
申请号:US14688310
申请日:2015-04-16
发明人: Satoru Tanaka
IPC分类号: G01P15/125 , B81B3/00 , G01P15/08
CPC分类号: B81B3/0008 , G01P15/125 , G01P2015/0814
摘要: An electronic device includes a first functional element including a first movable element capable of moving in a first axis direction, and a first dummy electrode; a second functional element including a second movable element capable of moving in a second axis direction intersecting with the first axis direction, and a second dummy electrode; and a first wiring interconnecting the first dummy electrode and the second dummy electrode.
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公开(公告)号:US09746490B2
公开(公告)日:2017-08-29
申请号:US14817324
申请日:2015-08-04
发明人: Satoru Tanaka
IPC分类号: G01P15/125 , G01C19/56 , G01C19/5719 , B81B3/00 , G01P15/08
CPC分类号: G01P15/125 , B81B3/0013 , B81B2201/0235 , B81B2201/0242 , B81B2201/033 , B81B2207/097 , B81C2203/0109 , B81C2203/031 , G01C19/5719 , G01P2015/0814
摘要: A physical quantity sensor includes: a base substrate; a movable portion; a plurality of movable electrode fingers which are provided in the movable portion; a fixed electrode finger which is provided on the base substrate; and a fixing portion which fixes the movable portion to the base substrate. In the movable electrode fingers, a movable electrode finger which opposes the fixing portion in the first direction is included. A clearance between the movable electrode finger and the fixing portion is smaller than a clearance between the movable electrode finger and the fixed electrode finger. The width of the movable electrode finger is greater than the width of other movable electrode finger.
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公开(公告)号:US20170227575A1
公开(公告)日:2017-08-10
申请号:US15093765
申请日:2016-04-08
发明人: Hsin-Hung Huang , Wei-Yang Ou , Hung-Sen Chen
IPC分类号: G01P21/00 , G01C25/00 , G01C19/5783 , G01P15/08 , G01P15/125
CPC分类号: G01P21/00 , B81C99/0045 , G01C19/5783 , G01C25/00 , G01P15/0802 , G01P15/125 , G01P2015/0814 , G01P2015/0831
摘要: A method of detecting whether a microelectromechanical system (MEMS) device is hermetic includes applying at least three voltage differences between a movable part and a sensor electrode of the MEMS device to measure at least three effective capacitances, calculating a capacitance-to-voltage curve and an offset voltage of the MEMS device according to the at least three effective capacitances; and determining whether the offset voltage is within a predetermined range to determine whether MEMS device is hermetic.
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9.
公开(公告)号:US09650237B2
公开(公告)日:2017-05-16
申请号:US14778514
申请日:2014-04-17
发明人: Ilker E. Ocak , Julius Ming Lin Tsai , Navab Singh
IPC分类号: B81B7/00 , H01L25/00 , G01C19/56 , G01R33/00 , G01R33/028 , G01P15/08 , G01P15/125 , B81C1/00
CPC分类号: B81B7/0048 , B81B2201/0235 , B81B2201/0242 , B81B2201/0271 , B81B2201/0292 , B81B2203/04 , B81B2207/07 , B81C1/00285 , B81C2203/0118 , B81C2203/0172 , G01C19/56 , G01P15/0802 , G01P15/125 , G01P2015/0814 , G01P2015/0828 , G01R33/00 , G01R33/0052 , G01R33/0286 , H01L25/00 , H01L2924/0002 , H01L2924/00
摘要: An electromechanical device and method of fabrication thereof comprising: providing a first wafer with a circuit arrangement on a first surface thereof and a first electrode on a second surface thereof; forming first and second via structures from the first surface to the second surface of the first wafer, said first via electrically connecting the first electrode with the circuit arrangement; providing a second wafer with a suspended structure on a first surface thereof; forming a second electrode on the suspended structure; forming an interconnect structure on the first surface of the second wafer that electrically connects with the second electrode; bonding the first wafer to the second wafer with the second surface of the first wafer facing the first surface of the second wafer, with the second via structure electrically connecting the circuit arrangement to the interconnect structure, and the first and second electrodes forming a capacitive structure.
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公开(公告)号:US20170108530A1
公开(公告)日:2017-04-20
申请号:US15182317
申请日:2016-06-14
IPC分类号: G01P15/125 , G01P1/00
CPC分类号: G01P15/125 , B81B3/0072 , G01C19/5755 , G01P1/00 , G01P2015/0814
摘要: A MEMS sensor device provided with a sensing structure, having: a substrate with a top surface extending in a horizontal plane; an inertial mass, suspended over the substrate; elastic coupling elements, elastically connected to the inertial mass so as to enable inertial movement thereof with respect to the substrate as a function of a quantity to be detected along a sensing axis belonging to the horizontal plane; and sensing electrodes, capacitively coupled to the inertial mass so as to form at least one sensing capacitor, a value of capacitance of which is indicative of the quantity to be detected. The sensing structure moreover has a suspension structure, to which the sensing electrodes are rigidly coupled, and to which the inertial mass is elastically coupled through the elastic coupling elements; the suspension structure is connected to an anchorage structure, fixed with respect to the substrate, by means of elastic suspension elements.
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