公开(公告)号：US20240371677A1

公开(公告)日：2024-11-07

申请号：US18775291

申请日：2024-07-17

Applicant: DENSO CORPORATION ,  OSAKA UNIVERSITY

Inventor： Kantaro HORI ,  Bahman Soltani ,  Kazufumi AOKI ,  Naoki Maruno ,  Yuya KATO ,  Kazuya Yamamura ,  Xu Yang

IPC: H01L21/683

Abstract: A chuck apparatus is configured to hold a wafer during planarization of the wafer with the aid of anodizing. The chuck apparatus includes a chuck cover, a suction portion, and an energizing portion. The suction portion includes a suction surface that suctions the wafer. The energizing portion is provided in the suction portion so as to come into contact and energize the wafer suctioned by the suction portion. The chuck cover covers the suction portion and the energizing portion in an insulating manner while exposing the suction surface.