公开(公告)号：US20250114982A1

公开(公告)日：2025-04-10

申请号：US18694783

申请日：2022-09-27

Applicant: DEXERIALS CORPORATION

Inventor： Saori SUGIOKA ,  Kosuke ASABA

IPC: B29C33/68

Abstract: A method for manufacturing a connection film achieves high productivity. The method includes printing an adhesive in a predetermined shape on a mold release film, and forming a connection film of a predetermined shape on the mold release film. A plurality of connection films of the predetermined shape are formed in the width direction of the mold release film, the mold release film is cut in the longitudinal direction at a predetermined width, a plurality of mold release films of the predetermined width are connected in the longitudinal direction, and the connected mold release films of the predetermined width are wound around a winding core. This enables high productivity.

公开(公告)号：US20220223315A1

公开(公告)日：2022-07-14

申请号：US17607466

申请日：2020-04-23

Applicant: DEXERIALS CORPORATION

Inventor： Yusuke TANAKA ,  Masaharu AOKI ,  Saori SUGIOKA ,  Hidetsugu NAMIKI ,  Shoko KUGA

IPC: H01B1/22 ,  H01B5/16 ,  H01R11/01

Abstract: A connection structure, a method of manufacturing the connection structure, a connection material, and a coated conductive particle capable of reducing and stabilizing a conduction resistance value. The connection structure includes: a first electronic component having a first terminal; a second electronic component having a second terminal, and a cured film provided between the first electronic component and the second electronic component and formed by curing the connection material, wherein, with regard to the coated conductive particles between the first terminal and the second terminal, metal atoms of the conductive layer diffuse into the metal of the metal fine particles, and metal atoms of the first terminal and the metal atoms of the second terminal diffuse into the metal of the metal fine particles.