公开(公告)号：US20190256675A1

公开(公告)日：2019-08-22

申请号：US16344489

申请日：2017-10-27

Applicant: DEXERIALS CORPORATION

Inventor： Takeshi MIYAKE ,  Shoko KUGA ,  Reiji TSUKAO

IPC: C08J5/18 ,  H01R4/04 ,  C09J5/00 ,  C09J7/38 ,  C09J9/02 ,  C09J11/04 ,  B32B27/08 ,  B32B27/20 ,  B32B7/022

Abstract: A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.

公开(公告)号：US20210261743A1

公开(公告)日：2021-08-26

申请号：US17315788

申请日：2021-05-10

Applicant: DEXERIALS CORPORATION

Inventor： Takeshi MIYAKE ,  Shoko KUGA ,  Reiji TSUKAO

IPC: C08J5/18 ,  C09J7/38 ,  B32B7/022 ,  B32B27/08 ,  B32B27/20 ,  C09J5/00 ,  C09J9/02 ,  C09J11/04 ,  H01R4/04 ,  B32B17/10

Abstract: A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.

公开(公告)号：US20220223315A1

公开(公告)日：2022-07-14

申请号：US17607466

申请日：2020-04-23

Applicant: DEXERIALS CORPORATION

Inventor： Yusuke TANAKA ,  Masaharu AOKI ,  Saori SUGIOKA ,  Hidetsugu NAMIKI ,  Shoko KUGA

IPC: H01B1/22 ,  H01B5/16 ,  H01R11/01

Abstract: A connection structure, a method of manufacturing the connection structure, a connection material, and a coated conductive particle capable of reducing and stabilizing a conduction resistance value. The connection structure includes: a first electronic component having a first terminal; a second electronic component having a second terminal, and a cured film provided between the first electronic component and the second electronic component and formed by curing the connection material, wherein, with regard to the coated conductive particles between the first terminal and the second terminal, metal atoms of the conductive layer diffuse into the metal of the metal fine particles, and metal atoms of the first terminal and the metal atoms of the second terminal diffuse into the metal of the metal fine particles.

公开(公告)号：US20240266086A1

公开(公告)日：2024-08-08

申请号：US18018796

申请日：2021-07-12

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Kaori WAKU ,  Takeshi NISHIO ,  Yusuke TANAKA ,  Shoko KUGA

IPC: H01B1/22 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36

CPC classification number: H01B1/22 ,  B23K35/0244 ,  B23K35/3613 ,  B23K35/302 ,  B23K35/3033

Abstract: A composite conductive particles capable of suppressing cracking and peeling of metal films to provide excellent adhesion of metal films, and a method for manufacturing a composite conductive particle. The composite conductive particle includes a host particle; and adhesive fine particles arranged on a surface of the host particle and containing oxygen atoms; and conductive fine particles in contact with the adhesive fine particle. By arranging adhesive fine particles containing oxygen atoms on the surface of the host particle and bringing the conductive fine particles into contact with the adhesive fine particles, it is possible to achieve excellent adhesion of the metal film.