公开(公告)号：US20220181369A1

公开(公告)日：2022-06-09

申请号：US17437350

申请日：2020-03-02

Applicant: DEXERIALS CORPORATION

Inventor： Yusuke TANAKA ,  Yusuke KAMATA ,  Hidetsugu NAMIKI ,  Manabu SUZUKI

IPC: H01L27/146 ,  H04N5/369

Abstract: A method of manufacturing a connection structure, connection structure, film structure, and a method of manufacturing a film structure capable of mounting an electronic component having a plurality of terminal rows on a mounting surface by using existing equipment, including: a pasting step of pasting, from a film structure including a tape-shaped base material and a connection film formed thereon, connection films having a unit region of a predetermined length in the length direction of the base material and a predetermined width in the width direction to a first or second electronic component having a plurality of terminal rows; and a connecting step of connecting terminals of the first and second electronic components through the connection films, wherein the film structure includes, in the unit region, in addition to portions corresponding to the plurality of terminal rows, a non-pasting portion in which the connection film is not pasted.

公开(公告)号：US20190337262A1

公开(公告)日：2019-11-07

申请号：US16463856

申请日：2017-11-20

Applicant: DEXERIALS CORPORATION

Inventor： Reiji TSUKAO ,  Shinichi HAYASHI ,  Seiichiro SHINOHARA ,  Yusuke TANAKA

IPC: B32B7/02 ,  C08L61/06 ,  C08L35/02 ,  C08J5/18 ,  H01F27/32 ,  H01R11/01 ,  H01R43/00 ,  B32B27/20 ,  B32B27/30 ,  B32B27/42

Abstract: A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 μm, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.

公开(公告)号：US20240266086A1

公开(公告)日：2024-08-08

申请号：US18018796

申请日：2021-07-12

Applicant: DEXERIALS CORPORATION

Inventor： Hidetsugu NAMIKI ,  Kaori WAKU ,  Takeshi NISHIO ,  Yusuke TANAKA ,  Shoko KUGA

IPC: H01B1/22 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36

CPC classification number: H01B1/22 ,  B23K35/0244 ,  B23K35/3613 ,  B23K35/302 ,  B23K35/3033

Abstract: A composite conductive particles capable of suppressing cracking and peeling of metal films to provide excellent adhesion of metal films, and a method for manufacturing a composite conductive particle. The composite conductive particle includes a host particle; and adhesive fine particles arranged on a surface of the host particle and containing oxygen atoms; and conductive fine particles in contact with the adhesive fine particle. By arranging adhesive fine particles containing oxygen atoms on the surface of the host particle and bringing the conductive fine particles into contact with the adhesive fine particles, it is possible to achieve excellent adhesion of the metal film.

公开(公告)号：US20250031468A1

公开(公告)日：2025-01-23

申请号：US18905331

申请日：2024-10-03

Applicant: DEXERIALS CORPORATION

Inventor： Yusuke TANAKA ,  Yusuke KAMATA ,  Hidetsugu NAMIKI ,  Manabu SUZUKI

IPC: H01L27/146 ,  H01L23/00

Abstract: A method of manufacturing a connection structure, connection structure, film structure, and a method of manufacturing a film structure capable of mounting an electronic component having a plurality of terminal rows on a mounting surface by using existing equipment, including: a pasting step of pasting, from a film structure including a tape-shaped base material and a connection film formed thereon, connection films having a unit region of a predetermined length in the length direction of the base material and a predetermined width in the width direction to a first or second electronic component having a plurality of terminal rows; and a connecting step of connecting terminals of the first and second electronic components through the connection films, wherein the film structure includes, in the unit region, in addition to portions corresponding to the plurality of terminal rows, a non-pasting portion in which the connection film is not pasted.

公开(公告)号：US20210394484A1

公开(公告)日：2021-12-23

申请号：US17463941

申请日：2021-09-01

Applicant: DEXERIALS CORPORATION

Inventor： Reiji TSUKAO ,  Shinichi HAYASHI ,  Seiichiro SHINOHARA ,  Yusuke TANAKA

IPC: B32B7/02 ,  C08L35/02 ,  C08J5/18 ,  H01F27/32 ,  H01R11/01 ,  H01R43/00 ,  B32B27/20 ,  B32B27/30 ,  B32B27/42 ,  C08L61/06

Abstract: A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 μm, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.

公开(公告)号：US20230159797A1

公开(公告)日：2023-05-25

申请号：US18098412

申请日：2023-01-18

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke SATO ,  Yasushi AKUTSU ,  Ryousuke ODAKA ,  Yusuke TANAKA

IPC: C09J9/02 ,  C09J7/10 ,  H05K3/32 ,  H04N23/54 ,  H01B1/22 ,  C09J11/04 ,  C09J163/00 ,  H01L27/146 ,  H01R4/04 ,  H05K1/18

CPC classification number: C09J9/02 ,  C09J7/10 ,  H05K3/323 ,  H04N23/54 ,  H01B1/22 ,  C09J11/04 ,  C09J163/00 ,  H01L27/14618 ,  H01R4/04 ,  H05K1/181 ,  C08K3/08

Abstract: An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

公开(公告)号：US20220223315A1

公开(公告)日：2022-07-14

申请号：US17607466

申请日：2020-04-23

Applicant: DEXERIALS CORPORATION

Inventor： Yusuke TANAKA ,  Masaharu AOKI ,  Saori SUGIOKA ,  Hidetsugu NAMIKI ,  Shoko KUGA

IPC: H01B1/22 ,  H01B5/16 ,  H01R11/01

Abstract: A connection structure, a method of manufacturing the connection structure, a connection material, and a coated conductive particle capable of reducing and stabilizing a conduction resistance value. The connection structure includes: a first electronic component having a first terminal; a second electronic component having a second terminal, and a cured film provided between the first electronic component and the second electronic component and formed by curing the connection material, wherein, with regard to the coated conductive particles between the first terminal and the second terminal, metal atoms of the conductive layer diffuse into the metal of the metal fine particles, and metal atoms of the first terminal and the metal atoms of the second terminal diffuse into the metal of the metal fine particles.

公开(公告)号：US20220110217A1

公开(公告)日：2022-04-07

申请号：US17426446

申请日：2020-01-24

Applicant: DEXERIALS CORPORATION

Inventor： Akihiro SHIBATA ,  Masahiro NISHIMOTO ,  Yusuke TANAKA ,  Hirokazu ODAGIRI ,  Katsuhiro DOI

IPC: H05K3/34 ,  H01L23/00

Abstract: To prevent defects in microparticles from occurring in a case of arraying the microparticles having a diameter of less than or equal to 50 μm on a base material. Provided is a microparticle arraying mask for arraying microparticles having a diameter of less than or equal to 50 μm on a base material. The microparticle arraying mask has through-holes into which the microparticles are inserted. An opening plane of the through-holes on a microparticle supply side has an area smaller than an area of an opening plane of the through-holes on a microparticle discharge side. In a case of assuming that a direction from the opening plane on the microparticle supply side to the opening plane on the microparticle discharge side is a positive direction of a z-axis, and a sectional area of the through-holes vertical to the z-axis is A, dA(z)/dz>0 holds in a whole region in the through-holes along the z-axis, and Expression (1) below is satisfied: 0.4≤t/d≤1.0  (1).

公开(公告)号：US20180002575A1

公开(公告)日：2018-01-04

申请号：US15541881

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke SATO ,  Yasushi AKUTSU ,  Ryousuke ODAKA ,  Yusuke TANAKA

IPC: C09J9/02 ,  H04N5/225 ,  H05K1/18 ,  C09J11/04 ,  H01B1/22 ,  H01L27/146 ,  H01R4/04 ,  C09J163/00 ,  C08K3/10 ,  C08K3/36 ,  C08K9/02 ,  H05K1/02

Abstract: An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.