公开(公告)号：US20220379408A1

公开(公告)日：2022-12-01

申请号：US17664739

申请日：2022-05-24

申请人： DISCO CORPORATION

发明人： Koji SHIONO ,  Haruki KAMIYAMA

IPC分类号： B23K26/50 ,  B23K26/064 ,  B23K26/06 ,  B23K26/067 ,  B23K26/082

摘要： A laser beam irradiation unit of a laser processing apparatus includes a first splitting unit that causes a laser beam emitted from a laser oscillator to branch into a first optical path and a second optical path, a first beam condenser that focuses the laser beam having been introduced to the first optical path, and a second beam condenser that focuses the laser beam having been introduced to the second optical path. The laser beam irradiation unit further includes a second splitting unit on the first optical path between the first splitting unit and the first beam condenser that splits the laser beam into at least two laser beams, and a laser beam scanning unit on the second optical path between the first splitting unit and the second beam condenser that executes scanning with the laser beam and introduces the laser beam to the second beam condenser.