公开(公告)号：US20220362972A1

公开(公告)日：2022-11-17

申请号：US17663059

申请日：2022-05-12

Applicant: DISCO CORPORATION

Inventor： Norihisa ARIFUKU ,  Masamitsu KIMURA

IPC: B29C35/08 ,  B29C39/00 ,  B29C39/02 ,  B29C39/38

Abstract: There is provided a manufacturing method of a protective-component-provided workpiece. The manufacturing method of a protective-component-provided workpiece includes a step of dissolving a thermoplastic resin whose solubility parameter is equal to or higher than 8.5, in a liquid ultraviolet-curable resin, to prepare a liquid mixed resin, a step of supplying the mixed resin to a support surface of a support table to form a resin layer with a predetermined thickness, a step of irradiating the resin layer with ultraviolet rays and curing the resin layer to form a protective component with a sheet shape, and a step of heating the sheet-shaped protective component before or after one surface of the sheet-shaped protective component and one surface of the workpiece are brought into close contact with each other, and causing the sheet-shaped protective component to come into close contact with the workpiece and integrate with the workpiece.

公开(公告)号：US20240424743A1

公开(公告)日：2024-12-26

申请号：US18672241

申请日：2024-05-23

Applicant: DISCO CORPORATION

Inventor： Norihisa ARIFUKU ,  Koshiro SUZUKI ,  Yukihiro KIRIBAYASHI ,  Masamitsu KIMURA

IPC: B29C65/16 ,  B29C71/00 ,  B29L7/00

Abstract: A forming method of a water-soluble protective film on a front surface of a plate-shaped object includes a water-soluble sheet arrangement step of arranging a water-soluble resin sheet having thermoplasticity on a side of the front surface of the plate-shaped object, and an integration step of heating the water-soluble resin sheet to melt or soften the same, and integrating the water-soluble resin sheet and the plate-shaped object, to form the water-soluble protective film on the plate-shaped object. Preferably, the water-soluble resin sheet may contain a light absorber. A processing method of a plate-shaped object includes the water-soluble sheet arrangement step and integration step.

公开(公告)号：US20240316721A1

公开(公告)日：2024-09-26

申请号：US18588473

申请日：2024-02-27

Applicant: DISCO CORPORATION

Inventor： Koshiro SUZUKI ,  Hideji HORITA ,  Masamitsu KIMURA

IPC: B24B37/24 ,  B24B37/04

CPC classification number: B24B37/24 ,  B24B37/042

Abstract: A polishing pad including a disc-shaped base to be mounted to a tip end of a rotatable spindle and a pad portion fixed to one end surface of the base has at least a polishing surface of the pad portion coated with a resin film until before the polishing pad is mounted to the spindle. A polishing method for polishing a wafer with a polishing pad includes a polishing pad mounting step of mounting the polishing pad to the tip end of the spindle, a separating step of separating the resin film from the pad portion, a holding step of holding the wafer on a holding surface of a chuck table, and a polishing step of polishing the wafer by individually rotating the polishing pad and the chuck table while the pad portion and the wafer are brought into contact with each other.

公开(公告)号：US20240258149A1

公开(公告)日：2024-08-01

申请号：US18409076

申请日：2024-01-10

Applicant: DISCO CORPORATION

Inventor： Koshiro SUZUKI ,  Masamitsu KIMURA ,  Hideji HORITA ,  Yuya TANAKA ,  Takashi NAKAHARA ,  Norihisa ARIFUKU

IPC: H01L21/683

CPC classification number: H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386

Abstract: A method of laying a protective sheet on a face side of a wafer includes preparing a first protective sheet having, on one surface thereof, a non-adhesive portion to be coextensive with a device region of the wafer and an adhesive portion to be positioned along an outer circumferential excessive region of the wafer, affixing the one surface of the first protective sheet to the face side of the wafer, dropping a liquid resin onto a surface of a second protective sheet that has surface irregularities ranging from Ra 0.2 to 7 μm and is free of an adhesive layer, bringing another surface of the first protective sheet into facing relation to the surface of the second protective sheet onto which the liquid resin has been dropped, and curing the liquid resin.

公开(公告)号：US20230187226A1

公开(公告)日：2023-06-15

申请号：US18061051

申请日：2022-12-02

Applicant: DISCO CORPORATION

Inventor： Hideji HORITA ,  Norihisa ARIFUKU ,  Masamitsu KIMURA

IPC: H01L21/56 ,  H01L21/683 ,  B29C51/00 ,  B29C51/42

CPC classification number: H01L21/566 ,  H01L21/6835 ,  B29C51/002 ,  B29C51/428 ,  H01L2221/68363

Abstract: A method of placing a protective member on a workpiece includes a sheet producing step of heating a plate-shaped thermoplastic resin to soften or melt the same while gripping and pulling outer edges of the thermoplastic resin in at least four directions to produce a sheet-like protective member, and after the sheet producing step, an integrating step of heating and bringing the sheet-like protective member into intimate contact with the workpiece to integrate the workpiece and the protective member with each other.

公开(公告)号：US20210151331A1

公开(公告)日：2021-05-20

申请号：US17089984

申请日：2020-11-05

Applicant: DISCO CORPORATION

Inventor： Norihisa ARIFUKU ,  Tomohiro KANEKO ,  Akifumi SUZUKI ,  Masamitsu KIMURA

IPC: H01L21/56 ,  H01L21/683 ,  B29C51/00 ,  B29C51/42

Abstract: A setting method of a protective component includes a resin supply step of supplying a thermoplastic resin to a flat support surface of a support table, and a protective component forming step of shaping the thermoplastic resin into a sheet shape through pressing and spreading the thermoplastic resin along the support surface while heating and softening the thermoplastic resin to form a protective component of the thermoplastic resin in the sheet shape on the support surface. The setting method includes also a protective component bonding step of bringing a front surface that is one surface of the workpiece into tight contact with one surface of the protective component in the sheet shape and heating the protective component in tight contact to bond the protective component to the workpiece, and a post-bonding cooling step of cooling the protective component heated in the protective component bonding step.