公开(公告)号：US20170113322A1

公开(公告)日：2017-04-27

申请号：US15331450

申请日：2016-10-21

申请人： DISCO CORPORATION

发明人： Soichiro Akita ,  Satoshi Kiyokawa

IPC分类号： B24B53/12 ,  B24B53/08

CPC分类号： B24B53/12 ,  B24B27/0608 ,  B24B49/12 ,  B24B53/053 ,  B24B53/062 ,  B24B53/08

摘要： Disclosed herein is a cutting apparatus including a moving unit for moving a spindle to position a cutting blade, a rotary dressing mechanism for rotating a dressing grindstone on a rotational shaft parallel to the spindle, and an optical sensor for detecting the position of the outer periphery of the dressing grindstone. The cutting blade is positioned with respect to the rotary dressing mechanism depending on the position, detected by the optical sensor, of the outer periphery of the dressing grindstone, and the cutting blade is dressed by cutting into the dressing grindstone by a predetermined cutting distance.

公开(公告)号：US10022838B2

公开(公告)日：2018-07-17

申请号：US15331450

申请日：2016-10-21

申请人： DISCO CORPORATION

发明人： Soichiro Akita ,  Satoshi Kiyokawa

IPC分类号： B24B53/12 ,  B24B49/12 ,  B24B53/08

摘要： Disclosed herein is a cutting apparatus including a moving unit for moving a spindle to position a cutting blade, a rotary dressing mechanism for rotating a dressing grindstone on a rotational shaft parallel to the spindle, and an optical sensor for detecting the position of the outer periphery of the dressing grindstone. The cutting blade is positioned with respect to the rotary dressing mechanism depending on the position, detected by the optical sensor, of the outer periphery of the dressing grindstone, and the cutting blade is dressed by cutting into the dressing grindstone by a predetermined cutting distance.