公开(公告)号：US12119230B2

公开(公告)日：2024-10-15

申请号：US17220990

申请日：2021-04-02

Applicant: DISCO CORPORATION

Inventor： Kazuma Sekiya ,  Takashi Ono ,  Daigo Shitabo

IPC: H01L21/306 ,  H01L21/67

CPC classification number: H01L21/30604 ,  H01L21/6708

Abstract: There is provided a wet etching method including an etchant supply step of supplying an etchant from an etchant supply nozzle to a to-be-etched surface of a workpiece, an etching step of etching the to-be-etched surface with the etchant remaining on the to-be-etched surface, and an etchant removal step of, after performing the etching step, removing the etchant, which still remains on the resulting etched surface, from the etched surface. The etchant supply step, the etching step, and the etchant removal step are repeated a plurality of times in this order.