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    Gettering layer forming method
    1.
    发明授权
    Gettering layer forming method 有权

    公开(公告)号：US10546758B2

    公开(公告)日：2020-01-28

    申请号：US15971538

    申请日：2018-05-04

    Applicant: DISCO CORPORATION

    Inventor： Daigo Shitabo ,  Seiji Harada ,  Hiroki Takeuchi

    IPC: H01L21/322 ,  H01L23/26

    Abstract: A gettering layer forming method includes a coating step of applying a solution of metal salt to a back side of a wafer, and a diffusing step of heating the wafer after performing the coating step, thereby diffusing the metal salt on the back side of the wafer to form a gettering layer containing the metal salt on the back side of the wafer, in which the metal salt is diffused in the gettering layer.

    Wet etching method and wet etching system
    2.
    发明授权
    Wet etching method and wet etching system 有权

    公开(公告)号：US12119230B2

    公开(公告)日：2024-10-15

    申请号：US17220990

    申请日：2021-04-02

    Applicant: DISCO CORPORATION

    Inventor： Kazuma Sekiya ,  Takashi Ono ,  Daigo Shitabo

    IPC: H01L21/306 ,  H01L21/67

    CPC classification number: H01L21/30604 ,  H01L21/6708

    Abstract: There is provided a wet etching method including an etchant supply step of supplying an etchant from an etchant supply nozzle to a to-be-etched surface of a workpiece, an etching step of etching the to-be-etched surface with the etchant remaining on the to-be-etched surface, and an etchant removal step of, after performing the etching step, removing the etchant, which still remains on the resulting etched surface, from the etched surface. The etchant supply step, the etching step, and the etchant removal step are repeated a plurality of times in this order.

    LASER PROCESSING METHOD AND FINE PARTICLE LAYER FORMING AGENT
    4.
    发明申请
    LASER PROCESSING METHOD AND FINE PARTICLE LAYER FORMING AGENT 审中-公开
    激光加工方法和细颗粒成型剂

    公开(公告)号：US20140175070A1

    公开(公告)日：2014-06-26

    申请号：US14102892

    申请日：2013-12-11

    Applicant: Disco Corporation

    Inventor： Yukinobu Ohura ,  Daigo Shitabo ,  Nobuyasu Kitahara ,  Seiji Harada

    IPC: B23K26/18 ,  B23K26/36

    CPC classification number: B23K26/18 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/50

    Abstract: A laser processing method including the steps of covering the back side of a workpiece with fine particles having absorptivity to the wavelength of a laser beam to be applied to the workpiece, thereby forming a fine particle layer on the back side of the workpiece, and next applying the laser beam through the fine particle layer to the back side of the workpiece to thereby perform ablation to the workpiece. The laser beam applied to the workpiece is absorbed by the fine particle layer to thereby suppress the scattering of the energy of the laser beam and the reflection of the laser beam, so that the ablation to the workpiece can be efficiently performed.

    Abstract translation: 一种激光加工方法，包括以下步骤：用对具有对待加工的激光束的波长具有吸收性的细小颗粒覆盖工件的背面，从而在工件的背面形成微粒层，接下来， 将激光束通过细颗粒层施加到工件的后侧，从而对工件进行烧蚀。 施加到工件的激光束被微粒层吸收，从而抑制激光束的能量的散射和激光束的反射，从而可以有效地进行对工件的烧蚀。

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