公开(公告)号：US20240238938A1

公开(公告)日：2024-07-18

申请号：US18391950

申请日：2023-12-21

Applicant: DISCO CORPORATION

Inventor： Takashi YAMAGUCHI

IPC: B24B41/00 ,  B24B41/06 ,  B24B51/00

CPC classification number: B24B41/005 ,  B24B41/068 ,  B24B51/00

Abstract: Provided is a grinding apparatus including a holding unit that holds a workpiece by a chuck table, a grinding unit, a transporting mechanism that has a holding part capable of holding the workpiece, a first table that holds the workpiece to be loaded onto the holding unit, a second table that holds the workpiece having been unloaded from the holding unit, and a controller. When the controller determines that replacement of a grinding wheel is necessary in a state in which all of the holding unit, the first table, and the second table are holding workpieces, the controller makes the holding part of the transporting mechanism hold the workpiece held by the holding unit.

公开(公告)号：US20240198489A1

公开(公告)日：2024-06-20

申请号：US18539676

申请日：2023-12-14

Applicant: DISCO CORPORATION

Inventor： Yujiro UMEZAWA ,  Jiro GENOZONO ,  Takashi YAMAGUCHI ,  Yuta ISOBE

IPC: B24D7/14 ,  B24D7/06 ,  B24D7/18

CPC classification number: B24D7/14 ,  B24D7/06 ,  B24D7/18

Abstract: A grinding wheel for grinding a workpiece has an annular wheel base and a plurality of grinding stones arrayed in an annular pattern on a side of one surface of the wheel base. The grinding stones each have a base portion having a mounting surface where the base portion is mounted on the wheel base, and a wear-accelerated portion that has a grinding surface to be brought into contact with the workpiece and is more prone to wearing than the base portion.

公开(公告)号：US20230025120A1

公开(公告)日：2023-01-26

申请号：US17811969

申请日：2022-07-12

Applicant: DISCO CORPORATION

Inventor： Daisuke AKITA ,  Makoto SAITO ,  Takashi YAMAGUCHI

IPC: B24B1/00 ,  B24B7/04 ,  B24B41/00 ,  B24B49/02

Abstract: A hard wafer grinding method includes a rough grinding step of forming a section along the diameter of a hard wafer into a centrally recessed shape by roughly grinding the hard wafer such that a central part of the hard wafer is thinner than a peripheral part of the hard wafer, a finish grinding step of expanding a ground area of the hard wafer from the peripheral part in an annular shape to the central part while dressing lower surfaces of finish grinding stones by the peripheral part of the hard wafer of the centrally recessed shape after the rough grinding, then setting the whole of a radius part of the hard wafer as the ground area, and further finish-grinding the hard wafer so as to obtain a predetermined thickness.

公开(公告)号：US20240066665A1

公开(公告)日：2024-02-29

申请号：US18446658

申请日：2023-08-09

Applicant: DISCO CORPORATION

Inventor： Hidenori NAGAI ,  Takashi YAMAGUCHI ,  Naruto FUWA

IPC: B24D3/34 ,  B24D3/06 ,  B24D3/14 ,  B24D3/28

CPC classification number: B24D3/342 ,  B24D3/06 ,  B24D3/14 ,  B24D3/28

Abstract: A grindstone includes abrasive grains and a binder for fixing the abrasive grains, and the binder contains a spherical filler for reinforcing the bonding material.