公开(公告)号：US11912910B2

公开(公告)日：2024-02-27

申请号：US17211986

申请日：2021-03-25

申请人： DONGWOO FINE-CHEM CO., LTD.

发明人： Hyuk Hwan Kwon ,  Sun Kwon Ahn ,  Chang Yong Lee

IPC分类号： C09J9/02 ,  H01B5/14 ,  C09J7/40 ,  G06F3/044 ,  B32B7/06 ,  B32B7/12 ,  B32B38/00

CPC分类号： C09J9/02 ,  B32B7/06 ,  B32B7/12 ,  B32B38/0004 ,  C09J7/403 ,  H01B5/14 ,  B32B2307/202 ,  C09J2203/326 ,  G06F3/044

摘要： A conductive film laminate according to an embodiment of the present disclosure includes a carrier substrate, a conductive film liner on the carrier substrate, and a conductive adhesive film formed on the conductive film liner. The conductive film liner and the conductive adhesive film may form a cut pattern which does not cover the entire carrier substrate. The conductive adhesive film having a narrow width can be stably supplied on the carrier substrate. The conductive adhesive film may be used as an anisotropic conductive film for a bonding process of a touch sensor.