公开(公告)号：US3873499A

公开(公告)日：1975-03-25

申请号：US42018073

申请日：1973-11-29

Applicant: DOW CORNING

Inventor： MICHAEL KEITH W ,  MINK ALAN E ,  MITCHELL DARRELL D

IPC: C08L83/00 ,  C08K5/13 ,  C08L83/04 ,  C08L83/08 ,  C09D183/04 ,  H01B3/46 ,  C08F11/04

CPC classification number: H01B3/46 ,  C08K5/13 ,  C08L83/04 ,  C08L83/08 ,  Y10T428/31612 ,  Y10T428/31663 ,  Y10T428/31678 ,  C08L83/00 ,  C08L2666/28

Abstract: Low temperature, fast curing electrical and coating resins, activated by ultraviolet or other low energy radiation, are obtained by mixing mercaptoalkyl siloxane resins with methylvinyl siloxanes and subjecting the mixture to ultraviolet light. An exemplary formulation is: 8.5 parts by weight of a copolymer of 20 mol percent mercaptopropyl siloxane, 50 mol percent monopropyl siloxane, 20 mol percent dimethyl siloxane and 10 mol percent monomethyl siloxane and 1.5 parts by weight of methylvinyl cyclosiloxane wherein the cyclics contain from 4 to 8 silicon atoms. These resins are particularly designed for circuit board coatings.

Abstract translation: 通过将巯基烷基硅氧烷树脂与甲基乙烯基硅氧烷混合并使混合物经受紫外光，得到通过紫外线或其他低能量辐射活化的低温，快速固化的电气和涂层树脂。 示例性配方是：8.5重量份的20摩尔％巯基丙基硅氧烷，50摩尔％的单丙基硅氧烷，20摩尔％的二甲基硅氧烷和10摩尔％的单甲基硅氧烷和1.5重量份的甲基乙烯基环硅氧烷的共聚物，其中环状物包含4 至8个硅原子。 这些树脂特别设计用于电路板涂层。