公开(公告)号：US20160197025A1

公开(公告)日：2016-07-07

申请号：US14652532

申请日：2013-10-29

Applicant: DOW CORNING CORPORATION

Inventor： Dorab Edul Bhagwagar ,  Lyndon Larson ,  Kristen Steinbrecher ,  James Tonge

IPC: H01L23/367 ,  H01L21/48

CPC classification number: H01L23/3675 ,  C08G77/12 ,  C08G77/20 ,  C09J183/04 ,  H01L21/4882 ,  H01L23/10 ,  H01L23/296 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/32245

Abstract: A silicone composition contains I) a shrink additive and II) a curable polyorganosiloxane composition. A method for fabricating an electronic device includes the steps of: 1) interposing the silicone composition between an IHS and a substrate, 2) curing the curable polyorganosiloxane composition to form a cured silicone product, and 3) removing the shrink additive during and/or after step 2), thereby compressing the IHS to the substrate. Compressing occurs as thickness of the cured silicone product decreases, as compared to thickness of the silicone composition interposed in step 1).

Abstract translation: 有机硅组合物包含I）收缩添加剂和II）可固化聚有机硅氧烷组合物。 一种用于制造电子器件的方法包括以下步骤：1）将硅氧烷组合物插入IHS和衬底之间; 2）固化可固化的聚有机硅氧烷组合物以形成固化的硅氧烷产品，以及3）在和/或 在步骤2）之后，从而将IHS压缩至基底。 与步骤1）中插入的有机硅组合物的厚度相比，随着固化的硅氧烷产品的厚度减小而发生压缩。