公开(公告)号：US09721694B2

公开(公告)日：2017-08-01

申请号：US14678665

申请日：2015-04-03

申请人： DOWA Electronics Materials Co., Ltd.

发明人： Shuji Kaneda ,  Kimikazu Motomura ,  Tatsuya Kariyasu ,  Yutaka Hisaeda ,  Kosuke Iha

IPC分类号： H01B1/02 ,  C08K3/22 ,  B82Y40/00 ,  B22F1/00 ,  B22F9/24 ,  B82Y30/00 ,  C09C1/62 ,  C09D5/24 ,  C09D17/00 ,  C22C5/06 ,  H01B1/22 ,  C22C5/08 ,  H01B1/16 ,  H01M4/38

CPC分类号： H01B1/02 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B22F1/0074 ,  B22F9/24 ,  B82Y30/00 ,  C01P2004/04 ,  C01P2004/64 ,  C01P2006/11 ,  C01P2006/12 ,  C09C1/62 ,  C09D5/24 ,  C09D17/006 ,  C22C5/06 ,  C22C5/08 ,  H01B1/16 ,  H01B1/22 ,  H01M4/38

摘要： A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.