公开(公告)号：US20040069528A1

公开(公告)日：2004-04-15

申请号：US10267363

申请日：2002-10-09

Applicant: DOWA MINING CO., LTD.

Inventor： Masami Sakuraba ,  Masami Kimura ,  Takashi Ono ,  Noriyuki Ishii ,  Nobuyoshi Tukaguchi

IPC: H05K001/09

CPC classification number: H05K3/06 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/708 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/26 ,  H05K3/38 ,  H05K2201/0355 ,  H05K2201/0761 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/121 ,  H01L2924/00

Abstract: A paste of brazing material of AgnullCunullTinullTiO2 system is printed to both sides of an AlN substrate; a copper sheet is then placed on both sides and heated in vacuum to be joined to the substrate. A resist having a desired-circuit pattern is coated on the surface of each copper sheet and etching is performed. A solution containing a mixture of EDTA, ammonia and aqueous hydrogen peroxide is then applied to dissolve away the unwanted brazing material and the like from between the circuit patterns without corroding the ceramic substrate and the metal sheet.

Abstract translation: 将Ag-Cu-Ti-TiO2系统的钎焊材料的糊料印刷到AlN衬底的两侧; 然后将铜片放置在两侧并在真空中加热以与基底接合。 具有所需电路图形的抗蚀剂涂覆在每个铜片的表面上，并进行蚀刻。 然后施加含有EDTA，氨和过氧化氢水溶液的溶液，从而在电路图案之间消除不想要的钎焊材料等，而不会腐蚀陶瓷基底和金属片。