公开(公告)号：US20160277845A1

公开(公告)日：2016-09-22

申请号：US15071230

申请日：2016-03-16

Applicant: DSP Group LTD.

Inventor： Haim Kupershmidt ,  Moti Margalit ,  Adi Baram

IPC: H04R19/02 ,  H04R19/00 ,  H04R31/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: H04R19/02 ,  H04R19/005 ,  H04R31/00 ,  H04R2201/003 ,  H04R2217/03

Abstract: A micro-electromechanical system (MEMS) device that comprises a substrate, support structures, functional elements and conductive paths that comprise conductive elements; wherein the functional elements are included in a plurality of functional layers, the plurality of functional layers are spaced apart from each other; wherein the support structures are configured to provide structural support to the plurality of functional layers; wherein each functional layer is coupled to a conducting interface via a conductive path that is associated with the functional layer; and wherein the support structures comprise lateral etch stop elements.

Abstract translation: 一种微机电系统（MEMS）装置，其包括基板，支撑结构，功能元件和包括导电元件的导电路径; 其中所述功能元件包括在多个功能层中，所述多个功能层彼此间隔开; 其中所述支撑结构被配置为向所述多个功能层提供结构支撑; 其中每个功能层经由与所述功能层相关联的导电路径耦合到导电接口; 并且其中所述支撑结构包括横向蚀刻停止元件。

公开(公告)号：US20160277838A1

公开(公告)日：2016-09-22

申请号：US15072379

申请日：2016-03-17

Applicant: DSP Group LTD.

Inventor： Haim Kupershmidt ,  Moti Margalit ,  Adi Baram

IPC: H04R7/16

CPC classification number: H04R31/00 ,  H04R1/403 ,  H04R19/005 ,  H04R19/02

Abstract: A micro-electromechanical system (MEMS) device that may include a substrate, support structures and functional elements; wherein the functional elements are included in a plurality of functional layers, the plurality of functional layers are spaced apart from each other; wherein the support structures are conductive and are configured to provide structural support to the plurality of functional layers; wherein each functional element is electrically coupled to at least one of the support structures; and wherein the support structures are spaced apart from each other.

Abstract translation: 可以包括衬底，支撑结构和功能元件的微机电系统（MEMS）装置; 其中所述功能元件包括在多个功能层中，所述多个功能层彼此间隔开; 其中所述支撑结构是导电的并且被配置成向所述多个功能层提供结构支撑; 其中每个功能元件电耦合到所述支撑结构中的至少一个; 并且其中所述支撑结构彼此间隔开。