公开(公告)号：US20210310126A1

公开(公告)日：2021-10-07

申请号：US16840280

申请日：2020-04-03

Applicant: DUPONT ELECTRONICS, INC. ,  ROHM AND HAAS ELECTRONIC MATERIALS LLC

Inventor： Husnu Alp Alidedeoglu ,  Patricia Gumbley ,  Cecilia Hall ,  Joseph Casey Johnson ,  Benjamin Naab ,  Jaclyn Murphy ,  Grzegorz Slawinski ,  Christopher Dennis Simone

IPC: C23C18/16 ,  H05K9/00 ,  C23C18/38 ,  C25D5/56 ,  C25D3/38 ,  C08G73/10

Abstract: In a first aspect, a metal-clad polymer film includes a polymer film adhered to a first metal layer. The root-mean-square roughness (Sq) of the interface between the polymer film and the first metal layer is less than 1 μm. The peel strength between the polymer film and the first metal layer is greater than 5 N/cm after 168 hours of aging at 150° C. when tested for a polymer film having a thickness in the range of from 25 to 75 μm and a first metal layer having a thickness of 18 μm in accordance with IPC-TM-650 test methods. The thickness of the first metal layer is 12 μm or less. The polymer film includes a first thermoplastic polyimide layer. In a second aspect, an electronic device includes the metal-clad polymer film of the first aspect. In a third aspect a process includes for forming a double-sided metal-clad polymer film.

公开(公告)号：US11535710B2

公开(公告)日：2022-12-27

申请号：US17197887

申请日：2021-03-10

Applicant: DUPONT ELECTRONICS, INC.

Inventor： Husnu Alp Alidedeoglu ,  Thomas Edward Carney ,  Joseph Casey Johnson ,  Lin Ju ,  Michael Thomas Kwasny ,  Laila MacLaughlin ,  Grzegorz Slawinski

IPC: C08G73/10 ,  C08K3/04 ,  C08K5/00 ,  C08K5/17 ,  C08L79/08 ,  C08J5/18

Abstract: In a first aspect, a single layer polymer film includes 60 to 99 wt % of a crosslinked polyimide, having a gel fraction in the range of from 20 to 100% and a refractive index of 1.74 or less, and 1 to 40 wt % of a colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (Spv) of 6 μm or more, an L* color of 30 or less and a 60° gloss of 15 or less. In a second aspect, a coverlay for a printed circuit board includes the single layer polymer film of the first aspect. In third and fourth aspects, processes are disclosed for forming a single layer polymer film including a crosslinked polyimide film including a dianhydride and a diamine.