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公开(公告)号:US20220259391A1
公开(公告)日:2022-08-18
申请号:US17739548
申请日:2022-05-09
Applicant: DUPONT ELECTRONICS, INC.
Inventor: Joseph Casey Johnson , Kostantinos Kourtakis
Abstract: In a first aspect, a polyimide corn position has a glass transition temperature of less than 300° C. and includes a polyimide derived from a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine. A polyimide film made from the polyimide composition has a b* of less than one for a film thickness of at least 30 microns.
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公开(公告)号:US20210155768A1
公开(公告)日:2021-05-27
申请号:US17088249
申请日:2020-11-03
Applicant: DUPONT ELECTRONICS, INC.
Inventor: Laila Maclaughlin , Husnu Alp Alidedeoglu , Christopher Robert Becks , Thomas Edward Carney , Scott John Herrmann , Joseph Casey Johnson
Abstract: In one aspect, a single layer polymer film includes 25 to 97.5 wt % of a polyimide having a refractive index of 1.74 or less, 0.5 to 20 wt % of a matting agent and 1 to 30 wt % of a black colorant. On an air side, the single layer polymer film has an L* color of 33 or less and a 60° gloss of 10 or less. In another aspect, a single layer polymer film includes 80 to 99 wt % of a polyimide having a refractive index of 1.74 or less and 1 to 30 wt % of a black colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (Spv) of 7 μm or more, an L* of 33 or less and a 60° gloss of 10 or less.
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公开(公告)号:US20210079181A1
公开(公告)日:2021-03-18
申请号:US16912654
申请日:2020-06-25
Applicant: DUPONT ELECTRONICS, INC.
Inventor: Kostantinos Kourtakis , Gene M Rossi , Joseph Casey Johnson , Michael Thomas Kwasny
Abstract: In a first aspect, a polyimide film includes a dianhydride and a diamine. The dianhydride, the diamine or both the dianhydride and the diamine include an alicyclic monomer, an aliphatic monomer or both an alicyclic monomer and an aliphatic monomer. The polyimide film has a b* of 1.25 or less and a yellowness index of 2.25 or less for a film thickness of 50 μm. The polyimide film is formed by: (a) polymerizing the dianhydride and the diamine in the presence of a first solvent to obtain a polyamic acid solution; (b) imidizing the polyamic acid solution to form a substantially imidized solution; (c) casting the substantially imidized solution to form a film; and (d) drying the film.
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公开(公告)号:US11718728B2
公开(公告)日:2023-08-08
申请号:US17088249
申请日:2020-11-03
Applicant: DUPONT ELECTRONICS, INC.
Inventor: Laila Maclaughlin , Husnu Alp Alidedeoglu , Christopher Robert Becks , Thomas Edward Carney , Scott John Herrmann , Joseph Casey Johnson
CPC classification number: C08K3/04 , C08G73/1067 , C08K3/36 , C08K5/01 , C08K2201/005
Abstract: In one aspect, a single layer polymer film includes 25 to 97.5 wt % of a polyimide having a refractive index of 1.74 or less, 0.5 to 20 wt % of a matting agent and 1 to 30 wt % of a black colorant. On an air side, the single layer polymer film has an L* color of 33 or less and a 60° gloss of 10 or less. In another aspect, a single layer polymer film includes 80 to 99 wt % of a polyimide having a refractive index of 1.74 or less and 1 to 30 wt % of a black colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (Spv) of 7 μm or more, an L* of 33 or less and a 60° gloss of 10 or less.
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公开(公告)号:US11535710B2
公开(公告)日:2022-12-27
申请号:US17197887
申请日:2021-03-10
Applicant: DUPONT ELECTRONICS, INC.
Inventor: Husnu Alp Alidedeoglu , Thomas Edward Carney , Joseph Casey Johnson , Lin Ju , Michael Thomas Kwasny , Laila MacLaughlin , Grzegorz Slawinski
Abstract: In a first aspect, a single layer polymer film includes 60 to 99 wt % of a crosslinked polyimide, having a gel fraction in the range of from 20 to 100% and a refractive index of 1.74 or less, and 1 to 40 wt % of a colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (Spv) of 6 μm or more, an L* color of 30 or less and a 60° gloss of 15 or less. In a second aspect, a coverlay for a printed circuit board includes the single layer polymer film of the first aspect. In third and fourth aspects, processes are disclosed for forming a single layer polymer film including a crosslinked polyimide film including a dianhydride and a diamine.
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公开(公告)号:US11700687B2
公开(公告)日:2023-07-11
申请号:US16899504
申请日:2020-06-11
Applicant: DUPONT ELECTRONICS, INC.
Inventor: Joseph Casey Johnson , Delanie J Losey , Peggy Scott , Christopher Dennis Simone
CPC classification number: H05K1/036 , B32B15/08 , B32B27/281 , H05K1/0393 , C08J2479/08 , C08L79/08 , H05K2201/0154 , Y10T428/31681 , Y10T428/31721
Abstract: In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a Df of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.
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公开(公告)号:US20230082265A1
公开(公告)日:2023-03-16
申请号:US17903762
申请日:2022-09-06
Applicant: DUPONT ELECTRONICS, INC.
Inventor: Kostantinos Kourtakis , Benjamin Samson , Kenneth Hernandez , Ross S Johnson , Dennis Walls , Neng Xiao , Lei Zhang , Joseph Casey Johnson
Abstract: In a first aspect, an article includes an inorganic substrate and a polymer film layer. The inorganic substrate includes a material including a ceramic, a glass, a glass-ceramic or a mixture thereof. The material includes a metal cation selected from the group consisting of silicon, aluminum, titanium, zirconium, tantalum, niobium and mixtures thereof and oxygen. The polymer film layer includes a polymer including an imide group. From an interface where the inorganic substrate contacts the polymer film layer, a line-profile of a CNO— signal from negative secondary ion mass spectroscopy decreases as it moves away from the interface and into the bulk of the polymer film layer.
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公开(公告)号:US20200270406A1
公开(公告)日:2020-08-27
申请号:US16794853
申请日:2020-02-19
Applicant: DUPONT ELECTRONICS, INC.
Inventor: Joseph Casey Johnson , Kostantinos Kourtakis
Abstract: In a first aspect, a polyimide film includes a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine. The polyimide film has a b* of less than one for a film thickness of at least 30 microns and a glass transition temperature of less than 300° C. In a second aspect, an electronic device includes the polyimide film of the first aspect.
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公开(公告)号:US11643515B2
公开(公告)日:2023-05-09
申请号:US17739548
申请日:2022-05-09
Applicant: DUPONT ELECTRONICS, INC.
Inventor: Joseph Casey Johnson , Kostantinos Kourtakis
CPC classification number: C08J5/18 , C08G73/1082 , C08J2379/08
Abstract: In a first aspect, a polyimide corn position has a glass transition temperature of less than 300° C. and includes a polyimide derived from a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine. A polyimide film made from the polyimide composition has a b* of less than one for a film thickness of at least 30 microns.
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公开(公告)号:US11603440B2
公开(公告)日:2023-03-14
申请号:US16912654
申请日:2020-06-25
Applicant: DUPONT ELECTRONICS, INC.
Inventor: Kostantinos Kourtakis , Gene M Rossi , Joseph Casey Johnson , Michael Thomas Kwasny
Abstract: In a first aspect, a polyimide film includes a dianhydride and a diamine. The dianhydride, the diamine or both the dianhydride and the diamine include an alicyclic monomer, an aliphatic monomer or both an alicyclic monomer and an aliphatic monomer. The polyimide film has a b* of 1.25 or less and a yellowness index of 2.25 or less for a film thickness of 50 μm. The polyimide film is formed by: (a) polymerizing the dianhydride and the diamine in the presence of a first solvent to obtain a polyamic acid solution; (b) imidizing the polyamic acid solution to form a substantially imidized solution; (c) casting the substantially imidized solution to form a film; and (d) drying the film.
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