Method of bonding using a polyester hot-melt adhesive
    1.
    发明授权
    Method of bonding using a polyester hot-melt adhesive 失效
    使用聚酯热熔胶粘合剂的方法

    公开(公告)号:US3890186A

    公开(公告)日:1975-06-17

    申请号:US30328972

    申请日:1972-11-02

    CPC classification number: C09J167/02 C08K3/013 C08L2666/54 C08L67/02

    Abstract: Improvements in the cementing of leather or other pieces together by using a melting adhesive of polyester, comprising terephthalic acid, with or without isophthalic acid, and one or more glycol, admixed with 0.01 to 0.3 weight percent of an inorganic powder with a grain size less than 5 microns.

    Abstract translation: 通过使用含有或不含间苯二甲酸的对苯二甲酸的聚酯的熔融粘合剂和一种或多种二醇,将0.01至0.3重量%的无机粉末与粒径较小的无机粉末混合在一起来改善皮革或其它部件的粘合 超过5微米。

    Hot melt adhesives comprising {11 to {11 aliphatic dicarboxylic acid modified phthalic acid polyester mixtures
    2.
    发明授权
    Hot melt adhesives comprising {11 to {11 aliphatic dicarboxylic acid modified phthalic acid polyester mixtures 失效
    热熔胶粘剂包含{11至{11二恶烷二酸改性聚偏二氯乙烯混合物

    公开(公告)号:US3699187A

    公开(公告)日:1972-10-17

    申请号:US3699187D

    申请日:1970-12-08

    Inventor: GARDZIELLA ARNO

    CPC classification number: C09J167/02 C08L67/02 C08L2666/54 Y10T428/31681

    Abstract: A polyester-containing hot-melt adhesive for the bonding of materials, based on a phthalic acid, an aliphatic C6 to C12 dicarboxylic acid, and a glycol with from two to 10 carbon atoms in the radical between the two OH groups, comprising A. ABOUT 20 TO 95 WT. PERCENT OF A POLYESTER WHEREIN ABOUT 5 TO 20 MOLE PERCENT OF THE DICARBOXYLIC ACID COMPONENT COMPRISES AN ALIPHATIC DICARBOXYLIC ACID, THE POLYESTER HAVING A MELTING POINT OF OVER ABOUT 150* C, and B. ABOUT 5 TO 80 WT. PERCENT OF A POLYESTER WHEREIN ABOUT 25 TO 35 MOLE PERCENT OF THE DICARBOXYLIC ACID COMPONENT COMPRISES AN ALIPHATIC DICARBOXYLIC ACID, THE POLYESTER HAVING A MELTING POINT BETWEEN ABOUT 50 AND 150* C.

    Abstract translation: 一种含有聚酯的热熔粘合剂,用于粘合基于邻苯二甲酸,脂族C 6至C 12二羧酸的物质和在两个OH基团之间的基团中具有2至10个碳原子的二醇,其包含A. 约20至95 WT。 聚酯的百分比约为5至20%的二羧酸成分含有一种二硫代羧酸,该聚酯具有超过150℃的熔点以及B约5至80℃。 聚酯的百分之二十五至三十五分之二十六烷酸含量的二聚酸组分包含二氢二羧酸,该聚酯具有约50至150℃之间的熔点。

Patent Agency Ranking