公开(公告)号：US07153740B2

公开(公告)日：2006-12-26

申请号：US10853628

申请日：2004-05-25

申请人： Dae-Hwan Kim ,  Min Heo ,  Dong-Won Shin ,  Byeong-Hyeon Lee

发明人： Dae-Hwan Kim ,  Min Heo ,  Dong-Won Shin ,  Byeong-Hyeon Lee

IPC分类号： H01L21/8242

CPC分类号： H01L28/91 ,  H01L27/0207 ,  H01L27/10852 ,  H01L27/10855

摘要： For fabricating lean-free stacked capacitors, openings are formed through layers of materials including a layer of support material displaced from a bottom of the openings. A respective first electrode is formed for a respective capacitor within each of the openings. The layer of support material is patterned to form support structures around the first electrodes. Masking spacers are formed around exposed top portions of the first electrodes, and exposed portions of the support material are etched away to form the support structures. Such stacked capacitors are applied within a DRAM (dynamic random access memory).

公开(公告)号：US09030825B2

公开(公告)日：2015-05-12

申请号：US13615583

申请日：2012-09-13

申请人： Min Heo

发明人： Min Heo

IPC分类号： H05K7/20 ,  H01L23/40 ,  H01L23/473

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/42 ,  H01L2924/00

摘要： The present disclosure relates to an apparatus for fastening a power semiconductor using an integral springy (elastic) clip, capable of fixing a power semiconductor, such as a diode and a MOSFET, using elasticity of a U-shaped clip by integrally molding the clip onto a housing of a plastic module. The apparatus includes an elastic (springy) clip integrally molded onto a lower surface of the housing and downwardly curved into a U-like shape in a bridge module in which a bridge of the power semiconductor protrudes through a through hole of the housing to be connected to a printed circuit board, whereby the power semiconductor is fixed by a force that the housing presses the power semiconductor.

摘要翻译： 本发明涉及一种用于使用整体弹性（弹性）夹固定功率半导体的装置，其能够使用U形夹的弹性将诸如二极管和MOSFET的功率半导体整体地成型到 塑料模块的外壳。 该装置包括一体地模制在壳体的下表面上并在桥模块中向下弯曲成U形形状的弹性（弹性）夹子，其中功率半导体的桥突通过待连接的壳体的通孔突出 到印刷电路板，由此通过壳体按压功率半导体的力来固定功率半导体。