公开(公告)号：US20070023610A1

公开(公告)日：2007-02-01

申请号：US11420205

申请日：2006-05-24

申请人： Dae-Jong Kim ,  Ho-Jeong Choi ,  Chan-Soon Park

发明人： Dae-Jong Kim ,  Ho-Jeong Choi ,  Chan-Soon Park

IPC分类号： G01C21/24

CPC分类号： G01R31/311 ,  G01R31/2831 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00

摘要： A method of and testing jig for sequentially testing front and rear surfaces of a semiconductor chip is shown. The testing jig includes a support package having a first cavity over which the semiconductor chip mounts; an infrared filter affixed relative to the first cavity and attached to a rear surface of the semiconductor chip; and a test substrate having a second cavity exposing the infrared filter and upon which the support package mounts. Front and rear surfaces of the semiconductor chip can be conveniently and sequentially tested. Because the testing jig includes the infrared filter and the heat pad, heat can be easily transmitted to the detective chip.

摘要翻译： 示出了用于顺序测试半导体芯片的前表面和后表面的方法和测试夹具。 测试夹具包括具有半导体芯片安装在其上的第一空腔的支撑封装; 相对于所述第一空腔固定并附着到所述半导体芯片的后表面的红外滤光器; 以及具有暴露所述红外滤光器的第二腔的测试衬底，并且所述支撑封装安装在所述衬底上。 半导体芯片的前表面和后表面可以方便且顺序地测试。 由于测试夹具包括红外线过滤器和热垫，因此热量可以很容易地传递到检测芯片。

公开(公告)号：US07323891B2

公开(公告)日：2008-01-29

申请号：US11420205

申请日：2006-05-24

申请人： Dae-Jong Kim ,  Ho-Jeong Choi ,  Chan-Soon Park

发明人： Dae-Jong Kim ,  Ho-Jeong Choi ,  Chan-Soon Park

IPC分类号： G01R31/02

CPC分类号： G01R31/311 ,  G01R31/2831 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00

摘要： A method of and testing jig for sequentially testing front and rear surfaces of a semiconductor chip is shown. The testing jig includes a support package having a first cavity over which the semiconductor chip mounts; an infrared filter affixed relative to the first cavity and attached to a rear surface of the semiconductor chip; and a test substrate having a second cavity exposing the infrared filter and upon which the support package mounts. Front and rear surfaces of the semiconductor chip can be conveniently and sequentially tested. Because the testing jig includes the infrared filter and the heat pad, heat can be easily transmitted to the defective chip.

摘要翻译： 示出了用于顺序测试半导体芯片的前表面和后表面的方法和测试夹具。 测试夹具包括具有半导体芯片安装在其上的第一空腔的支撑封装; 相对于所述第一空腔固定并附着到所述半导体芯片的后表面的红外滤光器; 以及具有暴露所述红外滤光器的第二腔的测试衬底，并且所述支撑封装安装在所述衬底上。 半导体芯片的前表面和后表面可以方便且顺序地测试。 由于测试夹具包括红外线过滤器和加热垫，所以热量可以很容易地传递到有缺陷的芯片。

公开(公告)号：US20070152684A1

公开(公告)日：2007-07-05

申请号：US11647287

申请日：2006-12-29

申请人： Ho-Jin Lee ,  Chan-Soon Park ,  Duck-Young Kim

发明人： Ho-Jin Lee ,  Chan-Soon Park ,  Duck-Young Kim

IPC分类号： G01R31/308

CPC分类号： G01R31/311

摘要： A photo-emission analysis apparatus may include a plate, a socket board on the plate, and configured to receive semiconductor chip package. The apparatus may further include a housing on the plate, the housing having an inlet configured to introduce air into the housing, and a photon detector configured external to the housing.

摘要翻译： 光发射分析装置可以包括板，板上的插座板，并且被配置为接收半导体芯片封装。 所述装置还可以包括在所述板上的壳体，所述壳体具有被配置为将空气引入到所述壳体中的入口，以及配置在所述壳体外部的光子检测器。