Apparatus for fabricating pre-press masking film
    1.
    发明授权
    Apparatus for fabricating pre-press masking film 失效
    用于制造预压屏蔽膜的装置

    公开(公告)号:US5027225A

    公开(公告)日:1991-06-25

    申请号:US304720

    申请日:1989-01-31

    IPC分类号: G03F1/00 G03F9/00

    CPC分类号: G03F1/90 G03F9/00

    摘要: An apparatus for fabricating a pre-press masking film used for correcting a color printing plate which is slightly tilted by a scanner based on an image edited by a layout system. The apparatus includes a coordinate data input unit for inputting coordinate data defining a trimming frame designated by the layout system, a tilt correcting unit for compensating for the tilt of the color printing plate by correcting the coordinate data, a unit for generating driving signals for forming a pre-press masking film based on the corrected coordinate data, and a cutter unit responsive to the driving signal for forming a pre-press masking film for cutting the masking film.

    Probing apparatus and positional deviation acquiring method

    公开(公告)号:US20060238905A1

    公开(公告)日:2006-10-26

    申请号:US11386747

    申请日:2006-03-23

    IPC分类号: G02B5/08

    CPC分类号: G01R31/2891

    摘要: In a prober, a post-contact image representing a region including a pad is acquired by capturing an image of a substrate after a probe has been brought into contact with the pad having an existing probe mark. An image storage unit stores in advance a pre-contact image representing the pad-inclusive region before the probe is brought into contact with the pad. A latest probe mark position acquiring unit acquires a position of a latest probe mark region created by the contact of the probe with the pad from among a plurality of probe mark regions in the post-contact image respectively corresponding to a plurality of probe marks on the pad by comparing the post-contact image with the pre-contact image. A positional deviation acquiring unit finds a deviation in a contact position of the probe with respect to the pad, based on the position of the latest probe mark region.

    Inspection method and program for inspecting electrical characteristics of a semiconductor wafer
    3.
    发明授权
    Inspection method and program for inspecting electrical characteristics of a semiconductor wafer 有权
    用于检查半导体晶片的电特性的检查方法和程序

    公开(公告)号:US08013621B2

    公开(公告)日:2011-09-06

    申请号:US12358796

    申请日:2009-01-23

    IPC分类号: G01R31/308

    CPC分类号: G01R31/2891

    摘要: Disclosed is an inspection method capable of performing an inspection of high reliability even for very fine and thin-film electrode pads of a target object, by using needle traces formed on the electrode pads and making the electrode pads repeatedly contact the probes at high accuracy. In the inspection method, under the control of a control unit 15 of an inspection apparatus 10, by using old needle traces formed on the respective pads P of the target object such as a semiconductor wafer W, contactable regions S for the probes 12A in preparation for a present inspection, so that each of the probes 12A contact each of the electrode pad P in the contactable region S and within an empty area with no needle trace.

    摘要翻译: 公开了一种能够通过使用形成在电极焊盘上的针迹并使电极焊盘以高精度反复接触探针的方式,即使对于目标物体的非常细小的薄膜电极焊盘也可以进行高可靠性的检查。 在检查方法中,在检查装置10的控制部15的控制下,通过使用形成在目标物体(例如半导体晶片W)的各个焊盘P上的旧针状迹线,准备探针12A的可接触区域S 为了进行现在的检查,使得每个探针12A接触可接触区域S中的电极焊盘P的每一个并且在没有针痕迹的空白区域内。

    INSPECTION METHOD AND PROGRAM STORAGE MEDIUM STORING THE METHOD
    4.
    发明申请
    INSPECTION METHOD AND PROGRAM STORAGE MEDIUM STORING THE METHOD 有权
    检验方法和程序存储介质存储方法

    公开(公告)号:US20090184729A1

    公开(公告)日:2009-07-23

    申请号:US12358796

    申请日:2009-01-23

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2891

    摘要: Disclosed is an inspection method capable of performing an inspection of high reliability even for very fine and thin-film electrode pads of a target object, by using needle traces formed on the electrode pads and making the electrode pads repeatedly contact the probes at high accuracy. In the inspection method, under the control of a control unit 15 of an inspection apparatus 10, by using old needle traces formed on the respective pads P of the target object such as a semiconductor wafer W, contactable regions S for the probes 12A in preparation for a present inspection, so that each of the probes 12A contact each of the electrode pad P in the contactable region S and within an empty area with no needle trace.

    摘要翻译: 公开了一种能够通过使用形成在电极焊盘上的针迹并使电极焊盘以高精度反复接触探针的方式,即使对于目标物体的非常细小的薄膜电极焊盘也可以进行高可靠性的检查。 在检查方法中,在检查装置10的控制部15的控制下,通过使用形成在目标物体(例如半导体晶片W)的各个焊盘P上的旧针状迹线,准备探针12A的可接触区域S 为了进行现在的检查,使得每个探针12A接触可接触区域S中的电极焊盘P的每一个并且在没有针痕迹的空白区域内。

    Probing apparatus and positional deviation acquiring method
    5.
    发明授权
    Probing apparatus and positional deviation acquiring method 有权
    探测装置和位置偏差获取方法

    公开(公告)号:US07477064B2

    公开(公告)日:2009-01-13

    申请号:US11386747

    申请日:2006-03-23

    IPC分类号: G01R31/02 G01R31/28

    CPC分类号: G01R31/2891

    摘要: In a prober, a post-contact image representing a region including a pad is acquired by capturing an image of a substrate after a probe has been brought into contact with the pad having an existing probe mark. An image storage unit stores in advance a pre-contact image representing the pad-inclusive region before the probe is brought into contact with the pad. A latest probe mark position acquiring unit acquires a position of a latest probe mark region created by the contact of the probe with the pad from among a plurality of probe mark regions in the post-contact image respectively corresponding to a plurality of probe marks on the pad by comparing the post-contact image with the pre-contact image. A positional deviation acquiring unit finds a deviation in a contact position of the probe with respect to the pad, based on the position of the latest probe mark region.

    摘要翻译: 在探测器中,通过在探针已经与具有现有探针标记的焊盘接触之后通过捕获衬底的图像来获取表示包括衬垫的区域的接触后图像。 图像存储单元在探针与垫接触之前,预先存储表示包含区域的区域的预接触图像。 最新的探针标记位置获取单元从分别对应于多个探针标记的接触后图像中的多个探针标记区域中获取由探针与垫接触而产生的最新探针标记区域的位置, 通过将接触后图像与预接触图像进行比较来实现。 位置偏差获取单元基于最新的探针标记区域的位置来找到探针相对于垫的接触位置的偏差。