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公开(公告)号:US20100194165A1
公开(公告)日:2010-08-05
申请号:US12684423
申请日:2010-01-08
Applicant: Daisuke IGUCHI
Inventor: Daisuke IGUCHI
CPC classification number: B60N2/2362 , Y10T29/49863
Abstract: A seat reclining device has a torsion spring for a cam, and a plurality of guide-protrusion pairs formed integral with the inside face of a stationary member for guiding movement of tooth blocks into and out of meshed-engagement with an internal tooth of a movable member. Two opposing circular-arc concave portions are formed on opposing faces of two circumferentially adjacent guide-protrusion sets. A space between the concave portions is dimensioned to be wider on a radially outward side for defining a spring accommodation space, and dimensioned to be narrower on a radially inward side for forming circumferentially-opposing convex portions. Two spring hooks engage with the respective convex portions under preload. One of the hooks is also engaged with the cam for forcing it in its locked direction. An anti-rotation protrusion is formed on the outside face of the stationary member at a position conforming to the spring accommodation space.
Abstract translation: 座椅倾斜装置具有用于凸轮的扭转弹簧和与固定构件的内表面一体形成的多个引导突起对,用于引导齿块的移动进入和移出与可移动的内齿啮合 会员。 两个相对的圆弧形凹部形成在两个周向相邻的导向突起组的相对面上。 凹部之间的空间在径向向外侧被设定为更宽,以限定弹簧容纳空间,并且在径向向内侧的尺寸更窄以形成周向相对的凸部。 两个弹簧钩在预载下与相应的凸部接合。 其中一个钩子也与凸轮啮合,迫使它处于锁定方向。 在与弹簧容置空间相符的位置处,在静止构件的外表面上形成防旋转突起。
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公开(公告)号:US20100250224A1
公开(公告)日:2010-09-30
申请号:US12640472
申请日:2009-12-17
Applicant: Daisuke IGUCHI , Takahiro HORIGUCHI
Inventor: Daisuke IGUCHI , Takahiro HORIGUCHI
IPC: G06F17/50
CPC classification number: G06F17/5036 , G06F2217/82
Abstract: A power source noise analysis device includes an analysis portion. The analysis portion estimates an internal impedance of a semiconductor chip being an object to be analyzed based on a power current waveform, which is obtained by simulation of the semiconductor chip based on design data of the semiconductor chip. The analysis portion carries out a noise analysis of a power system including a board having the semiconductor chip mounted thereon based on the internal impedance.
Abstract translation: 电源噪声分析装置包括分析部。 分析部基于通过基于半导体芯片的设计数据模拟半导体芯片获得的功率电流波形,来估计作为要分析对象的半导体芯片的内部阻抗。 分析部分基于内部阻抗对包括其上安装有半导体芯片的板的电力系统进行噪声分析。
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公开(公告)号:US20100289156A1
公开(公告)日:2010-11-18
申请号:US12624490
申请日:2009-11-24
Applicant: Daisuke IGUCHI , Kanji OTSUKA , Yutaka AKIYAMA
Inventor: Daisuke IGUCHI , Kanji OTSUKA , Yutaka AKIYAMA
IPC: H01L25/07
CPC classification number: H01L23/66 , H01L24/17 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2223/6638 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2225/0651 , H01L2225/06517 , H01L2225/06531 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/14 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: According to an aspect of the invention, a semiconductor device includes a substrate having an opening area, a first semiconductor chip, and a second semiconductor chip. The first semiconductor chip has a first electrode for high-speed communication and that is disposed around the opening area on the substrate. The second semiconductor chip has a second electrode and third electrode for power and low-speed communication and that is disposed on the first semiconductor chip so that the first electrode is coupled with the second electrode by electrostatic coupling and dielectric coupling, the third electrode facing the opening area.
Abstract translation: 根据本发明的一个方面,半导体器件包括具有开口面积的衬底,第一半导体芯片和第二半导体芯片。 第一半导体芯片具有用于高速连通的第一电极,并且设置在基板上的开口区域周围。 第二半导体芯片具有用于功率和低速连通的第二电极和第三电极,并且设置在第一半导体芯片上,使得第一电极通过静电耦合和电介质耦合与第二电极耦合,第三电极面向 开放区域。
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