SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
    2.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 有权
    半导体器件的半导体器件和制造方法

    公开(公告)号:US20070167010A1

    公开(公告)日:2007-07-19

    申请号:US11622767

    申请日:2007-01-12

    IPC分类号: H01L21/44

    摘要: To provide a semiconductor device having a structure in which a barrier metal film containing nitrogen is formed in a connection surface between a copper alloy wiring and a via, in which the electric resistance between the copper alloy wiring and the via can be prevented from rising, and the electric resistance can be prevented from varying. A semiconductor device according to the present invention comprises a first copper alloy wiring, a via and a first barrier metal film. The first copper alloy wiring is formed in an interlayer insulation film and contains a predetermined additive element in a main component Cu. The via is formed in an interlayer insulation film and electrically connected to the upper surface of the first copper alloy wiring. The first barrier metal film is formed so as to be in contact with the first copper alloy wiring in the connection part between the first copper alloy wiring and the via and contains nitrogen. The predetermined additive element reacts with nitrogen to form a high-resistance part. In addition, the concentration of the predetermined additive element is not more than 0.04 wt %.

    摘要翻译: 为了提供一种半导体器件,其具有在铜合金布线和通孔之间的连接面上形成含有氮的阻挡金属膜的结构,其中可以防止铜合金布线和通孔之间的电阻上升, 并且可以防止电阻变化。 根据本发明的半导体器件包括第一铜合金布线,通孔和第一阻挡金属膜。 第一铜合金布线形成在层间绝缘膜中,并且在主要成分Cu中含有预定的添加元素。 通孔形成在层间绝缘膜中并与第一铜合金布线的上表面电连接。 第一阻挡金属膜形成为与第一铜合金布线和通孔之间的连接部分中的第一铜合金布线接触并且包含氮。 预定的添加元素与氮反应形成高电阻部分。 此外,预定添加元素的浓度不大于0.04重量%。

    VIBRATION ACTUATOR AND ELECTRONIC EQUIPMENT
    4.
    发明申请

    公开(公告)号:US20190296627A1

    公开(公告)日:2019-09-26

    申请号:US16288242

    申请日:2019-02-28

    IPC分类号: H02K33/18

    摘要: A vibration actuator includes a movable body provided with one of a coil and a magnet that is disposed radially inward of the coil with a gap formed therebetween, a fixing body provided with the other of the coil and the magnet and a shaft portion, and an elastic support portion, the movable body vibrating in a vibration direction by means of cooperation between the coil supplied with power and the magnet. The movable body is provided with a through-hole into which the shaft portion is inserted with a gap formed between the through-hole and an outer peripheral surface of the shaft portion and the elastic support portion supports the movable body such that the movable body does not come into contact with the shaft portion at a time when the movable body does not vibrate and at a time when the movable body vibrates.