公开(公告)号：US08638564B2

公开(公告)日：2014-01-28

申请号：US13233748

申请日：2011-09-15

Applicant: Daniel J Buschel ,  Wai M Ma ,  Donald A Merte

Inventor： Daniel J Buschel ,  Wai M Ma ,  Donald A Merte

IPC: H05K1/14

CPC classification number: H05K3/00 ,  H05K3/22 ,  H05K3/3436 ,  H05K2201/10734 ,  H05K2203/0271 ,  H05K2203/085 ,  H05K2203/176

Abstract: An apparatus may include a housing forming an enclosure having an edge seatable on a printed circuit board (PCB). The enclosure edge may include an edge portion. The housing may be configured to transfer a force applied to the housing to a surface mount component mounted on the PCB to dismount the surface mount component. The apparatus may include a dye inlet formed by the housing and configured to conduct a dye into the enclosure. Another apparatus may include at least one gasket mounted to the enclosure edge to contact the major surface of the PCB adjacent to the surface mount component for forming a seal with the PCB. A method may include enclosing a surface mount component in an enclosure formed in a nozzle apparatus, introducing a dye into the enclosure, and applying a force to the nozzle apparatus to dismount the surface mount component.

Abstract translation: 一种装置可以包括形成具有可位于印刷电路板（PCB）上的边缘的外壳的壳体。 外壳边缘可以包括边缘部分。 壳体可以被配置为将施加到壳体的力传递到安装在PCB上的表面安装部件以卸下表面安装部件。 该装置可以包括由壳体形成并构造成将染料导入外壳的染料入口。 另一装置可以包括安装到外壳边缘的至少一个垫片，以接触邻近表面安装部件的PCB的主表面，以与PCB形成密封。 方法可以包括将表面安装部件封闭在形成在喷嘴装置中的外壳中，将染料引入外壳中，以及向喷嘴装置施加力以卸下表面安装部件。