Modular controller for a hot melt adhesive dispensing system
    1.
    发明授权
    Modular controller for a hot melt adhesive dispensing system 失效
    用于热熔胶分配系统的模块化控制器

    公开(公告)号:US06977817B2

    公开(公告)日:2005-12-20

    申请号:US10252617

    申请日:2002-09-23

    摘要: A controller for a hot melt adhesive dispensing system has a main circuit board and power modules which are removably received on a controller enclosure. The power modules are directly couplable with the main board and with cord sets from heated hoses of the dispensing system, eliminating the need for wiring harnesses to be routed between these components. Accordingly, the main board and power modules may be readily removed and replaced in the field to permit efficient servicing and modification of the system to accommodate the needs of various applications.

    摘要翻译: 用于热熔胶分配系统的控制器具有可拆卸地容纳在控制器外壳上的主电路板和电源模块。 电源模块可与主板和分配系统的加热软管的电缆组件直接连接,无需在这些组件之间布线。 因此,主板和功率模块可以在现场容易地移除和更换,以允许系统的有效维护和修改以适应各种应用的需要。