公开(公告)号：US07038462B2

公开(公告)日：2006-05-02

申请号：US10710145

申请日：2004-06-22

申请人： David Danovitch ,  Richard Langlois ,  Martin Lapointe ,  Robert-Paul Leclerc

发明人： David Danovitch ,  Richard Langlois ,  Martin Lapointe ,  Robert-Paul Leclerc

IPC分类号： G01R31/08 ,  G01R31/02

CPC分类号： G01R31/2805 ,  G01R1/06711

摘要： Improved methods and apparatus is disclosed for electrical testing of electronic circuits such as those existing in microcircuit devices including chip carriers, printed circuit boards and substrates. The invention provides for the testing of the continuity of electronic circuits in progressively smaller devices having increased density of circuits and having pads closely spaced. A quasi-fluidized bed of conductive particles is provided for effectively contacting pads on a first side of a substrate. Pads on another side of the substrate which are connected to the pads on the first side are then contacted by a test device. The circuit interconnecting respective pads on the two sides of the substrate can then be assessed for electrical continuity.

摘要翻译： 公开了用于诸如存在于包括芯片载体，印刷电路板和基板的微电路设备中的电子电路的电测试的改进的方法和装置。 本发明提供了具有增加的电路密度并且具有紧密间隔的垫的逐渐更小的器件中的电子电路的连续性的测试。 提供了导电颗粒的准流化床，用于有效地接触衬底的第一侧上的衬垫。 然后，连接到第一侧的焊盘的衬底的另一侧上的焊盘被测试装置接触。 然后可以评估将衬底两侧的相应焊盘互连的电路的电气连续性。

公开(公告)号：US20050062493A1

公开(公告)日：2005-03-24

申请号：US10710145

申请日：2004-06-22

申请人： David Danovitch ,  Richard Langlois ,  Martin Lapointe ,  Robert-Paul Leclerc

发明人： David Danovitch ,  Richard Langlois ,  Martin Lapointe ,  Robert-Paul Leclerc

IPC分类号： G01R1/04 ,  G01R1/067 ,  G01R31/28 ,  G01R31/26

CPC分类号： G01R31/2805 ,  G01R1/06711

摘要： Improved methods and apparatus is disclosed for electrical testing of electronic circuits such as those existing in microcircuit devices including chip carriers, printed circuit boards and substrates. The invention provides for the testing of the continuity of electronic circuits in progressively smaller devices having increased density of circuits and having pads closely spaced. A quasi-fluidized bed of conductive particles is provided for effectively contacting pads on a first side of a substrate. Pads on another side of the substrate which are connected to the pads on the first side are then contacted by a test device. The circuit interconnecting respective pads on the two sides of the substrate can then be assessed for electrical continuity.

摘要翻译： 公开了用于诸如存在于包括芯片载体，印刷电路板和基板的微电路设备中的电子电路的电测试的改进的方法和装置。 本发明提供了具有增加的电路密度并且具有紧密间隔的垫的逐渐更小的器件中的电子电路的连续性的测试。 提供了导电颗粒的准流化床，用于有效地接触衬底的第一侧上的衬垫。 然后，连接到第一侧的焊盘的衬底的另一侧上的焊盘被测试装置接触。 然后可以评估将衬底两侧的相应焊盘互连的电路的电气连续性。