Method, apparatus, and system for mounting an electronic device
    7.
    发明授权
    Method, apparatus, and system for mounting an electronic device 有权
    用于安装电子设备的方法,装置和系统

    公开(公告)号:US08481190B2

    公开(公告)日:2013-07-09

    申请号:US13476798

    申请日:2012-05-21

    IPC分类号: H01M2/02

    摘要: A battery cover for an electronic device including a battery receptacle. The battery cover generally comprises a base and a cover mating element. The base is operable to couple with a portion of the electronic device and at least partially cover the battery receptacle. The cover mating element is operable to couple with the base and interchangeably mate with a reciprocal mating element associated with a mount to couple the electronic device to the mount.

    摘要翻译: 一种用于包括电池插座的电子设备的电池盖。 电池盖通常包括基座和盖配合元件。 基座可操作以与电子设备的一部分耦合并且至少部分地覆盖电池插座。 盖配合元件可操作以与基座联接并且可互换地与与安装件相关联的往复配合元件配合以将电子设备耦合到安装件。

    METHOD, APPARATUS, AND SYSTEM FOR MOUNTING AN ELECTRONIC DEVICE
    8.
    发明申请
    METHOD, APPARATUS, AND SYSTEM FOR MOUNTING AN ELECTRONIC DEVICE 有权
    用于安装电子设备的方法,装置和系统

    公开(公告)号:US20120231312A1

    公开(公告)日:2012-09-13

    申请号:US13476798

    申请日:2012-05-21

    IPC分类号: H01M2/10

    摘要: A battery cover for an electronic device including a battery receptacle. The battery cover generally comprises a base and a cover mating element. The base is operable to couple with a portion of the electronic device and at least partially cover the battery receptacle. The cover mating element is operable to couple with the base and interchangeably mate with a reciprocal mating element associated with a mount to couple the electronic device to the mount.

    摘要翻译: 一种用于包括电池插座的电子设备的电池盖。 电池盖通常包括基座和盖配合元件。 基座可操作以与电子设备的一部分耦合并且至少部分地覆盖电池插座。 盖配合元件可操作以与基座联接并且可互换地与与安装件相关联的往复配合元件配合以将电子设备耦合到安装座。

    METHOD, APPARATUS, AND SYSTEM FOR MOUNTING AN ELECTRONIC DEVICE
    9.
    发明申请
    METHOD, APPARATUS, AND SYSTEM FOR MOUNTING AN ELECTRONIC DEVICE 审中-公开
    用于安装电子设备的方法,装置和系统

    公开(公告)号:US20090101767A1

    公开(公告)日:2009-04-23

    申请号:US12146266

    申请日:2008-06-25

    IPC分类号: H05K5/00

    摘要: A battery cover for an electronic device including a battery receptacle. The battery cover generally comprises a base and a cover mating element. The base is operable to couple with a portion of the electronic device and at least partially cover the battery receptacle. The cover mating element is operable to couple with the base and interchangeably mate with a reciprocal mating element associated with a mount to couple the electronic device to the mount.

    摘要翻译: 一种用于包括电池插座的电子设备的电池盖。 电池盖通常包括基座和盖配合元件。 基座可操作以与电子设备的一部分耦合并且至少部分地覆盖电池插座。 盖配合元件可操作以与基座联接并且可互换地与与安装件相关联的往复配合元件配合以将电子设备耦合到安装件。

    Separable ball and socket assembly for electronic device mounts
    10.
    发明授权
    Separable ball and socket assembly for electronic device mounts 有权
    用于电子设备安装座的可分离的球窝组件

    公开(公告)号:US07296771B2

    公开(公告)日:2007-11-20

    申请号:US11304836

    申请日:2005-12-15

    IPC分类号: A47F5/00

    摘要: Embodiments of the present invention provide a mounting assembly (100) for mounting an electronic device (D) to a surface (S). The mounting assembly (100) generally includes a base (102) including a mounting ball (110) and a socket assembly (104) operable to frictionally engage the ball (110) to removably couple the socket assembly (104) to the base (102). The base (102) may be removably coupled with the surface (S) and the socket assembly (104) may be removably coupled with the electronic device (D). Such a configuration enables the electronic device (D) to be easily positioned in confined environments by first attaching the base (102) to the surface (S), then attaching the socket assembly (104) to the base (102) and positioning the socket assembly (104) in a desired orientation, and finally attaching the electronic device (D) to the socket assembly (104).

    摘要翻译: 本发明的实施例提供一种用于将电子设备(D)安装到表面(S)的安装组件(100)。 安装组件(100)通常包括底座(102),其包括安装球(110)和插座组件(104),其可操作以摩擦地接合球(110),以将插座组件(104)可拆卸地联接到基座(102) )。 基座(102)可以与表面(S)可拆卸地联接,并且插座组件(104)可以与电子设备(D)可拆卸地联接。 这样的配置使得电子设备(D)能够通过首先将基座(102)附接到表面(S)而容易地定位在密闭环境中,然后将插座组件(104)附接到基座(102)并将插座 组件(104),并且最后将电子设备(D)附接到插座组件(104)。