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    Method and mechanism for modeling interconnect structures for integrated circuits
    1.
    发明授权
    Method and mechanism for modeling interconnect structures for integrated circuits 有权
    集成电路互连结构建模方法及机制

    公开(公告)号：US08316336B1

    公开(公告)日：2012-11-20

    申请号：US12643813

    申请日：2009-12-21

    Applicant: David Overhauser

    Inventor： David Overhauser

    IPC: G06F17/50 ,  G06F19/00 ,  H03K17/16 ,  H03K19/00 ,  H01L25/00 ,  H01L29/30 ,  H01L39/00 ,  H01L23/48 ,  H01L23/52

    CPC classification number: H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Disclosed are methods, systems, and structures for implementing interconnect modeling by using a test structure which include a variation of physical wire structures between local interconnects and distant interconnects. According to one approach, the impact of variations of the physical properties for neighborhood wires are considered for the electrical modeling of interconnects. This variation between the local and distant wire characteristics allows more accurate and robust interconnect modeling to be created.

    Abstract translation: 公开了通过使用测试结构来实现互连建模的方法，系统和结构，其包括局部互连和远距互连之间的物理线结构的变化。 根据一种方法，对于互连的电气建模，考虑邻近导线的物理性质变化的影响。 本地和远距离线特性之间的这种变化允许创建更准确和更强大的互连建模。

    Multi-directional wiring on a single metal layer
    2.
    发明授权
    Multi-directional wiring on a single metal layer 有权
    单一金属层上的多向布线

    公开(公告)号：US06858928B1

    公开(公告)日：2005-02-22

    申请号：US09733104

    申请日：2000-12-07

    Applicant: Steven Teig ,  David Overhauser ,  Akira Fujimura

    Inventor： Steven Teig ,  David Overhauser ,  Akira Fujimura

    IPC: H01L23/528 ,  H01L23/12 ,  G06L9/45

    CPC classification number: H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections, such that a first section has a preferred direction and the second section has a preferred wiring direction that is different from the first preferred direction. The first and second preferred directions on a single metal layer may consist of any direction. The metal layer may be divided into more than two sections, wherein each section has a preferred wiring direction. Wiring geometries for multi-level metal layers are also disclosed.

    Abstract translation: 集成电路具有包括为集成电路芯片的组件提供互连的导体的金属层。 金属层被分成至少两个部分，使得第一部分具有优选的方向，并且第二部分具有不同于第一优选方向的优选的布线方向。 单个金属层上的第一和第二优选方向可由任何方向组成。 金属层可以被分成多于两个部分，其中每个部分具有优选的布线方向。 还公开了多层金属层的接线几何形状。

    Method and mechanism for modeling interconnect structures for integrated circuits
    3.
    发明授权
    Method and mechanism for modeling interconnect structures for integrated circuits 有权
    集成电路互连结构建模方法及机制

    公开(公告)号：US07653519B1

    公开(公告)日：2010-01-26

    申请号：US11404636

    申请日：2006-04-13

    Applicant: David Overhauser

    Inventor： David Overhauser

    IPC: G06F17/50

    CPC classification number: H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Disclosed are methods, systems, and structures for implementing interconnect modeling by using a test structure which include a variation of physical wire structures between local interconnects and distant interconnects. According to one approach, the impact of variations of the physical properties for neighborhood wires are considered for the electrical modeling of interconnects. This variation between the local and distant wire characteristics allows more accurate and robust interconnect modeling to be created.

    Abstract translation: 公开了通过使用测试结构来实现互连建模的方法，系统和结构，其包括局部互连和远距互连之间的物理线结构的变化。 根据一种方法，对于互连的电气建模，考虑邻近导线的物理性质变化的影响。 本地和远距离线特性之间的这种变化允许创建更准确和更强大的互连建模。

    Simulating diagonal wiring directions using Manhattan directional wires
    4.
    发明授权
    Simulating diagonal wiring directions using Manhattan directional wires 有权
    使用曼哈顿方向导线模拟对角线路线方向

    公开(公告)号：US06900540B1

    公开(公告)日：2005-05-31

    申请号：US10043853

    申请日：2002-01-11

    Applicant: Steven Teig ,  David Overhauser ,  Akira Fujimura

    Inventor： Steven Teig ,  David Overhauser ,  Akira Fujimura

    IPC: H01L23/528 ,  H01L23/48 ,  G06F17/50 ,  H01L23/52 ,  H01L29/40

    CPC classification number: H01L23/528 ,  H01L2924/0002 ,  Y10T29/49162 ,  H01L2924/00

    Abstract: An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections, such that a first section has a preferred direction and the second section has a preferred wiring direction that is different from the first preferred direction. The first and second preferred directions on a single metal layer may consist of any direction. The metal layer may be divided into more than two sections, wherein each section has a preferred wiring direction. Wiring geometries for multi-level metal layers are also disclosed.

    Abstract translation: 集成电路具有包括为集成电路芯片的组件提供互连的导体的金属层。 金属层被分成至少两个部分，使得第一部分具有优选的方向，并且第二部分具有不同于第一优选方向的优选的布线方向。 单个金属层上的第一和第二优选方向可由任何方向组成。 金属层可以被分成多于两个部分，其中每个部分具有优选的布线方向。 还公开了多层金属层的接线几何形状。

    Simulating euclidean wiring directions using manhattan and diagonal directional wires
    5.
    发明授权
    Simulating euclidean wiring directions using manhattan and diagonal directional wires 有权
    使用曼哈顿和对角方向线模拟欧几里德线路方向

    公开(公告)号：US06858935B1

    公开(公告)日：2005-02-22

    申请号：US10043808

    申请日：2002-01-11

    Applicant: Steven Teig ,  David Overhauser ,  Akira Fujimura

    Inventor： Steven Teig ,  David Overhauser ,  Akira Fujimura

    IPC: H01L23/528 ,  H01L23/48

    CPC classification number: H01L23/528 ,  H01L2924/0002 ,  Y10T29/49162 ,  H01L2924/00

    Abstract: An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections, such that a first section has a preferred direction and the second section has a preferred wiring direction that is different from the first preferred direction. The first and second preferred directions on a single metal layer may consist of any direction. The metal layer may be divided into more than two sections, wherein each section has a preferred wiring direction. Wiring geometries for multi-level metal layers are also disclosed.

    Abstract translation: 集成电路具有包括为集成电路芯片的组件提供互连的导体的金属层。 金属层被分成至少两个部分，使得第一部分具有优选的方向，并且第二部分具有不同于第一优选方向的优选的布线方向。 单个金属层上的第一和第二优选方向可由任何方向组成。 金属层可以被分成多于两个部分，其中每个部分具有优选的布线方向。 还公开了多层金属层的接线几何形状。

    Multidirectional wiring on a single metal layer
    7.
    发明申请
    Multidirectional wiring on a single metal layer 审中-公开
    在单个金属层上的多向布线

    公开(公告)号：US20050240894A1

    公开(公告)日：2005-10-27

    申请号：US11031472

    申请日：2005-01-06

    Applicant: Steven Teig ,  David Overhauser ,  Akira Fujimura

    Inventor： Steven Teig ,  David Overhauser ,  Akira Fujimura

    IPC: H01L23/528 ,  G06F17/50

    CPC classification number: H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections, such that a first section has a preferred direction and the second section has a preferred wiring direction that is different from the first preferred direction. The first and second preferred directions on a single metal layer may consist of any direction. The metal layer may be divided into more than two sections, wherein each section has a preferred wiring direction. Wiring geometries for multi-level metal layers are also disclosed.

    Abstract translation: 集成电路具有包括为集成电路芯片的组件提供互连的导体的金属层。 金属层被分成至少两个部分，使得第一部分具有优选的方向，并且第二部分具有不同于第一优选方向的优选的布线方向。 单个金属层上的第一和第二优选方向可由任何方向组成。 金属层可以被分成多于两个部分，其中每个部分具有优选的布线方向。 还公开了多层金属层的接线几何形状。

    Integrated circuit wiring architectures to support independent designs
    8.
    发明授权
    Integrated circuit wiring architectures to support independent designs 有权
    集成电路布线架构，支持独立设计

    公开(公告)号：US06870255B1

    公开(公告)日：2005-03-22

    申请号：US09739582

    申请日：2000-12-15

    Applicant: Steven Teig ,  David Overhauser ,  Akira Fujimura

    Inventor： Steven Teig ,  David Overhauser ,  Akira Fujimura

    IPC: H01L23/528 ,  H01L23/12 ,  G06L9/45

    CPC classification number: H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections, such that a first section has a preferred direction and the second section has a preferred wiring direction that is different from the first preferred direction. The first and second preferred directions on a single metal layer may consist of any direction. The metal layer may be divided into more than two sections, wherein each section has a preferred wiring direction. Wiring geometries for multi-level metal layers are also disclosed.

    Abstract translation: 集成电路具有包括为集成电路芯片的组件提供互连的导体的金属层。 金属层被分成至少两个部分，使得第一部分具有优选的方向，并且第二部分具有不同于第一优选方向的优选的布线方向。 单个金属层上的第一和第二优选方向可由任何方向组成。 金属层可以被分成多于两个部分，其中每个部分具有优选的布线方向。 还公开了多层金属层的接线几何形状。

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