Memory module connector having memory module cooling structures
    1.
    发明授权
    Memory module connector having memory module cooling structures 有权
    具有存储模块冷却结构的内存模块连接器

    公开(公告)号:US08139355B2

    公开(公告)日:2012-03-20

    申请号:US12786067

    申请日:2010-05-24

    IPC分类号: H05K7/20

    摘要: One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A metallic or otherwise highly heat-conductive base is secured to the DIMM connector. A pair of heat spreaders is secured to the base on opposing sides of the DIMM socket. Each heat spreader includes a DIMM-engagement portion spaced from the base. The heat spreaders are nondestructively moveable between an open position spaced apart for receiving the DIMM between the heat spreaders and a closed position for thermally engaging opposing faces of the DIMM. The heat spreaders provide a continuous thermally-conductive pathway between the DIMM-engagement portion and the base. Heatsink fins extend laterally from the base to provide cooling.

    摘要翻译: 本发明的一个实施例提供了一种计算机存储器系统,其包括具有用于可释放地接收DIMM的终端边缘的DIMM插槽的至少一个DIMM连接器。 金属或其他高度导热的基座固定到DIMM连接器。 一对散热器在DIMM插槽的相对侧固定到基座。 每个散热器包括与基座间隔开的DIMM接合部分。 散热器在间隔开的开放位置之间是非破坏性的,以在散热器之间接收DIMM,并且用于热接合DIMM的相对面的闭合位置。 散热器在DIMM接合部分和基座之间提供连续的导热通路。 散热片从基座横向延伸以提供冷却。