公开(公告)号：US11833589B2

公开(公告)日：2023-12-05

申请号：US17654452

申请日：2022-03-11

Applicant: Dell Products L.P.

Inventor： Chih-Chieh Chang ,  Wei-Yi Li ,  Chun-Min He

IPC: B22F3/22 ,  B22F3/10 ,  G06F1/16 ,  B22F5/10

CPC classification number: B22F3/225 ,  B22F3/1025 ,  B22F5/10 ,  G06F1/1681 ,  B22F2998/00

Abstract: Method of forming a switch bracket of a hinge for a two-body information handling system, including mixing metal powders and binders to form a blended mix; pelletizing the blended mix to form feedstock; injecting the feedstock into a switch bracket mold cavity to form a first article of the switch bracket; de-binding the first article to remove the binders from the first article forming a second article of the switch bracket; and sintering the second article by shrinking the second article to form the switch bracket.

公开(公告)号：US11757216B2

公开(公告)日：2023-09-12

申请号：US17650433

申请日：2022-02-09

Applicant: Dell Products L.P.

Inventor： Fong-An Kan ,  Ming Chu Kuo ,  Yi-Chu Hsieh ,  Chun-Min He

IPC: H01R12/71 ,  H01R13/426 ,  H01R13/629

CPC classification number: H01R12/712 ,  H01R13/426 ,  H01R13/629

Abstract: In one embodiment, a clip pin of a secondary printed circuit board removably coupled to a primary printed circuit board and a backplate in an information handling system includes: an open end configured to receive a guide pin of the backplate within a clip pin hole of the primary printed circuit board, the guide pin configured to removably couple to the clip pin via the open end; a bulbous portion disposed proximate to the open end, the guide pin causing the bulbous portion to apply an outward force on an inner wall of the clip pin hole; and a plurality of signal pins disposed within the bulbous portion, the outward force causing the plurality of signal pins to communicably couple to the inner wall to transmit a signal from the secondary printed circuit board to the primary printed circuit board.

公开(公告)号：US20230253723A1

公开(公告)日：2023-08-10

申请号：US17650433

申请日：2022-02-09

Applicant: Dell Products L.P.

Inventor： Fong-An Kan ,  Ming Chu Kuo ,  Yi-Chu Hsieh ,  Chun-Min He

IPC: H01R12/71 ,  H01R13/629 ,  H01R13/426

CPC classification number: H01R12/712 ,  H01R13/629 ,  H01R13/426

Abstract: In one embodiment, a clip pin of a secondary printed circuit board removably coupled to a primary printed circuit board and a backplate in an information handling system includes: an open end configured to receive a guide pin of the backplate within a clip pin hole of the primary printed circuit board, the guide pin configured to removably couple to the clip pin via the open end; a bulbous portion disposed proximate to the open end, the guide pin causing the bulbous portion to apply an outward force on an inner wall of the clip pin hole; and a plurality of signal pins disposed within the bulbous portion, the outward force causing the plurality of signal pins to communicably couple to the inner wall to transmit a signal from the secondary printed circuit board to the primary printed circuit board.

公开(公告)号：US11832393B2

公开(公告)日：2023-11-28

申请号：US17844972

申请日：2022-06-21

Applicant: Dell Products L.P.

Inventor： Yu-Lin Tsai ,  Chia-Hsien Lu ,  Chun-Min He ,  RungLung Lin ,  Chin-Chung Wu

IPC: H05K13/04 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K13/0465 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/10689

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

公开(公告)号：US20220322591A1

公开(公告)日：2022-10-06

申请号：US17844972

申请日：2022-06-21

Applicant: Dell Products L.P.

Inventor： Yu-Lin Tsai ,  Chia-Hsien Lu ,  Chun-Min He ,  RungLung Lin ,  Chin-Chung Wu

IPC: H05K13/04 ,  H05K3/30 ,  H05K1/18

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

公开(公告)号：US11432447B2

公开(公告)日：2022-08-30

申请号：US16432451

申请日：2019-06-05

Applicant: Dell Products L.P.

Inventor： Yu-Lin Tsai ,  Chia-Hsien Lu ,  Chun-Min He ,  RungLung Lin ,  Chin-Chung Wu

IPC: H05K13/04 ,  H05K3/30 ,  H05K1/18

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.