公开(公告)号：US11432447B2

公开(公告)日：2022-08-30

申请号：US16432451

申请日：2019-06-05

Applicant: Dell Products L.P.

Inventor： Yu-Lin Tsai ,  Chia-Hsien Lu ,  Chun-Min He ,  RungLung Lin ,  Chin-Chung Wu

IPC: H05K13/04 ,  H05K3/30 ,  H05K1/18

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

公开(公告)号：US11832393B2

公开(公告)日：2023-11-28

申请号：US17844972

申请日：2022-06-21

Applicant: Dell Products L.P.

Inventor： Yu-Lin Tsai ,  Chia-Hsien Lu ,  Chun-Min He ,  RungLung Lin ,  Chin-Chung Wu

IPC: H05K13/04 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K13/0465 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/10689

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

公开(公告)号：US20220322591A1

公开(公告)日：2022-10-06

申请号：US17844972

申请日：2022-06-21

Applicant: Dell Products L.P.

Inventor： Yu-Lin Tsai ,  Chia-Hsien Lu ,  Chun-Min He ,  RungLung Lin ,  Chin-Chung Wu

IPC: H05K13/04 ,  H05K3/30 ,  H05K1/18

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.