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1.
公开(公告)号:US20040072008A1
公开(公告)日:2004-04-15
申请号:US10676393
申请日:2003-10-01
Applicant: Delphi Technologies, Inc.
Inventor: Thomas Hubert Van Steenkiste , George Albert Drew , Daniel William Gorkiewicz , Bryan A. Gillispie
IPC: B05D001/12 , B05D005/12 , B32B015/16
CPC classification number: H01R13/03 , H01R4/58 , Y10T428/12063 , Y10T428/12104 , Y10T428/12486 , Y10T428/12708 , Y10T428/12736 , Y10T428/12903 , Y10T428/24851 , Y10T428/24917 , Y10T428/25
Abstract: The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.
Abstract translation: 本发明涉及电触头,其包括嵌入并结合到导体表面中的间隔开的导电颗粒,其中颗粒已经以足够的能量动力地喷射到导体上,以在预先形成颗粒和导体之间形成直接机械结合 - 选择位置和粒子数密度,促进高表面接触和降低导体之间的接触电阻。
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公开(公告)号:US20030207148A1
公开(公告)日:2003-11-06
申请号:US10418244
申请日:2003-04-16
Applicant: DELPHI TECHNOLOGIES, INC.
Inventor: Bryan A. Gillispie , Zhibo Zhao , John Robert Smith , Thomas Hubert Van Steenkiste , Alaa A. Elmoursi , Yang Luo , Hartley F. Hutchins
IPC: B32B015/20 , B05D001/12
CPC classification number: C23C24/04 , B23K1/0012 , B23K2101/14 , F28F19/06 , Y10S428/937 , Y10S428/94 , Y10T428/12014 , Y10T428/12028 , Y10T428/12063 , Y10T428/1209 , Y10T428/12493 , Y10T428/12639 , Y10T428/12736 , Y10T428/12764 , Y10T428/12792
Abstract: The present invention is directed to a process for preparing aluminum and aluminum alloy surfaces in heat exchangers for brazing by depositing thereon a kinetic sprayed brazing composition. The process simultaneously deposits monolith or composite coatings that can include all braze materials and corrosion protection materials used in the brazing of aluminum fins to plates and tubes in a single stage.
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