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    Copper foil for printed circuit
    4.
    发明授权
    Copper foil for printed circuit 有权
    铜箔印刷电路

    公开(公告)号：US09580829B2

    公开(公告)日：2017-02-28

    申请号：US13635147

    申请日：2011-02-03

    申请人： Hideta Arai ,  Atsushi Miki

    发明人： Hideta Arai ,  Atsushi Miki

    IPC分类号： B21C37/00 ,  C25D7/06 ,  C25D5/12 ,  H05K3/38 ,  C25D1/04 ,  C25D3/38 ,  C25D3/56 ,  C25D3/58 ,  C25D9/04

    CPC分类号： C25D7/0614 ,  C25D1/04 ,  C25D3/38 ,  C25D3/562 ,  C25D3/58 ,  C25D5/12 ,  C25D5/16 ,  C25D9/04 ,  C25D15/00 ,  H05K1/09 ,  H05K3/20 ,  H05K3/384 ,  H05K2203/0307 ,  Y10T428/12028

    摘要： Disclosed is a copper foil for printed circuits prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer; in which the average particle size of the primary particle layer is 0.25 to 0.45 μm, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 μm. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

    摘要翻译： 公开了一种印刷电路用铜箔，其通过在铜箔的表面上形成铜的一次粒子层，然后在一次粒子层上形成基于由铜，钴和镍构成的三元合金的二次粒子层， 一次粒子层的平均粒径为0.25〜0.45μm，由铜，钴，镍构成的三元合金的二次粒子层的平均粒径为0.05〜0.25μm。 提供一种用于印刷电路的铜箔，其中可以减少从铜箔掉落的粉末，并且可以通过在铜箔的表面上形成铜的一次粒子层来改善剥离强度和耐热性，然后形成 在一次粒子层上基于铜 - 钴 - 镍合金电镀的二次粒子层。

    Method and apparatus for increasing the resolution in additively manufactured three-dimensional articles
    9.
    发明授权
    Method and apparatus for increasing the resolution in additively manufactured three-dimensional articles 有权
    用于增加附加制造的三维制品中的分辨率的方法和装置

    公开(公告)号：US09079248B2

    公开(公告)日：2015-07-14

    申请号：US14349052

    申请日：2012-12-04

    申请人： Arcam AB

    发明人： Ulf Ackelid

    IPC分类号： B23K15/00 ,  B22F3/105 ,  B29C67/00 ,  B23K26/34 ,  B22F3/10 ,  B22F3/24

    CPC分类号： B22F3/1055 ,  B22F3/1039 ,  B22F3/105 ,  B22F3/24 ,  B22F2201/10 ,  B22F2201/11 ,  B22F2201/12 ,  B22F2201/20 ,  B22F2999/00 ,  B23K15/00 ,  B23K26/342 ,  B29C64/00 ,  B29C64/153 ,  B29C67/00 ,  B33Y30/00 ,  Y02P10/295 ,  Y10T428/12028 ,  B22F2201/013 ,  B22F2201/02 ,  B22F2201/30 ,  B22F2201/04 ,  B22F2201/016

    摘要： A method for increasing the resolution when forming a three-dimensional article through successive fusion of parts of a powder bed, said method comprising providing a vacuum chamber, providing an electron gun, providing a first powder layer on a work table inside said vacuum chamber, directing an electron beam from said electron gun over said work table causing the powder layer to fuse in selected locations to form a first cross section of said three-dimensional article, providing a second powder layer on said work table, directing the electron beam over said work table causing said second powder layer to fuse in selected locations to form a second cross section of said three-dimensional article, reducing the pressure in the vacuum chamber from a first pressure level to a second pressure level between the providing of said first powder layer and said second powder layer.

    摘要翻译： 一种用于通过粉末床部分的连续融合来形成三维制品时的分辨率的方法，所述方法包括提供真空室，提供电子枪，在所述真空室内的工作台上提供第一粉末层， 将来自所述电子枪的电子束引导到所述工作台上，使粉末层在所选择的位置熔化以形成所述三维制品的第一横截面，在所述工作台上提供第二粉末层， 使所述第二粉末层在所选择的位置熔合以形成所述三维制品的第二横截面，从而在提供所述第一粉末层之间将真空室中的压力从第一压力水平降低到第二压力水平 和所述第二粉末层。