公开(公告)号：US20040252457A1

公开(公告)日：2004-12-16

申请号：US10691647

申请日：2003-10-24

Applicant: Delta Electronics, Inc.

Inventor： Hung-Chang Hsieh ,  Chih-Chi Wu ,  Jui-Yuan Hsu ,  Chih-Jen Chen ,  Min-Kuang Chang

IPC: H05K007/20

CPC classification number: H05K7/20909 ,  G06F1/20

Abstract: A heat-dispersing module of an electronic device is disclosed. The heat-dispersing module includes: a housing having a top surface, a bottom surface, a first side surface and a second side surface, wherein the first side surface is opposite to the second side surface; a heat-dispersing fan mounted on the first side surface of the housing; a first vent area disposed on the second side surface of the housing; a second vent area disposed on the top surface of the housing; and a printed circuit board positioned in the housing, thereby a first airflow channel is formed between the top surface of the housing and the printed circuit board and a second airflow channel is formed between the bottom surface of the housing and the printed circuit board, wherein the printed circuit board produces a relatively higher heat at the second airflow channel than the first airflow channel and a distance of the second airflow channel from the printed circuit board to the bottom surface is relatively larger than that of the first airflow channel from the printed circuit board to the top surface.

Abstract translation: 公开了一种电子设备的散热模块。 散热模块包括：壳体，其具有顶表面，底表面，第一侧表面和第二侧表面，其中第一侧表面与第二侧表面相对; 安装在所述壳体的所述第一侧表面上的散热风扇; 设置在所述壳体的第二侧表面上的第一通气区域; 设置在所述壳体的顶表面上的第二通气区域; 以及位于壳体中的印刷电路板，由此在壳体的顶表面和印刷电路板之间形成第一气流通道，并且在壳体的底表面和印刷电路板之间形成第二气流通道，其中 印刷电路板在第二气流通道处产生比第一气流通道相对较高的热量，并且第二气流通道从印刷电路板到底面的距离比来自印刷电路的第一气流通道的距离 板到顶面。

公开(公告)号：US20040218360A1

公开(公告)日：2004-11-04

申请号：US10691641

申请日：2003-10-24

Applicant: Delta Electronics, Inc.

Inventor： Hung-Chang Hsieh ,  Chih-Chi Wu ,  Jui-Yuan Hsu ,  Chih-Jen Chen ,  Min-Wen Kao ,  Jen-Chieh Peng

IPC: H05K007/20

CPC classification number: H05K7/20172

Abstract: A heat-dissipating fan module of an electronic apparatus is disclosed. The heat-dissipating fan module includes a casing having an opening, the opening having a guiding device along an edge thereof, and a heat-dissipating fan fixed to one side of the casing and correspondingly disposed on the opening.

Abstract translation: 公开了一种电子设备的散热风扇组件。 散热风扇模块包括具有开口的壳体，该开口具有沿其边缘的引导装置，以及固定在壳体的一侧并相应地设置在开口上的散热风扇。

公开(公告)号：US20040115967A1

公开(公告)日：2004-06-17

申请号：US10615679

申请日：2003-07-09

Applicant: Delta Electronics, Inc.

Inventor： Chih-Chi Wu ,  Wen-Chuan Lo ,  Szu-Lu Huang

IPC: H01R012/00

CPC classification number: H01R13/741

Abstract: A combination structure of a socket and a container is provided. The combination structure includes a container having an opening, and a socket includes a connecting section for being engaged with the opening, a first end extended from the connecting section for being electrically connected to an electronic equipment which is positioned outside the container, and a second end extended from the connecting section for electrically connecting to a circuit unit which is positioned inside the container, wherein a cross-section of the second end is greater than that of the opening and the cross-section of the opening is greater than that of the first end so that the first end is passed through the opening from an inside of the container and exposed to an outside of the container, and the opening blocks the second end for avoiding the second end passing therethrough and fixing the socket inside the container besides mutually fixing the connecting section.

Abstract translation: 提供了插座和容器的组合结构。 组合结构包括具有开口的容器，并且插座包括用于与开口接合的连接部分，从连接部分延伸的第一端，用于电连接到位于容器外部的电子设备，第二端 从连接部延伸出来的端部，用于电连接到位于容器内部的电路单元，其中第二端的横截面大于开口的横截面，并且开口的横截面大于 第一端使得第一端从容器的内部通过开口并暴露于容器的外部，并且开口阻止第二端以避免第二端通过，并且将插座固定在容器内部，除了相互之外 固定连接部分。