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公开(公告)号:US20220120511A1
公开(公告)日:2022-04-21
申请号:US17336002
申请日:2021-06-01
Applicant: Delta Electronics, Inc.
Inventor: Shih-Lin Huang , Xiaojun Chen , Guangshuai Wang
Abstract: A heat pipe structure and a manufacturing method are provided. The heat pipe structure includes a case, a wick structure and two lateral sealing structures. The case includes an enclosed space in a sealing state. The wick structure is disposed within the enclosed space and includes a first end and a second end opposite to each other. The two lateral sealing structures are configured to seal two opposite sides of the case. One of the two lateral sealing structures clamps the first end of the wick structure. The other of the lateral sealing structures clamps the second end of the wick structure.
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公开(公告)号:US20240344774A1
公开(公告)日:2024-10-17
申请号:US18750928
申请日:2024-06-21
Applicant: Delta Electronics, Inc.
Inventor: Shih-Lin Huang , Xiaojun Chen , Guangshuai Wang
CPC classification number: F28D15/046 , F28D15/0283 , F28D15/0233
Abstract: A manufacturing method of a heat pipe structure is provided. Firstly, a step S1 is performed. An original heat pipe structure is provided. The original heat pipe structure includes an enclosed space in a sealed state and an original wick structure disposed within the enclosed space. Then, a step S2 is performed. Portion of the original heat pipe structure is deformed to form a deformation portion. The deformation portion clamps portion of the original wick structure. The enclosed space is separated into two subspaces. Then, a step S3 is performed. The deformation portion is cut to separate the two subspaces to form two heat pipe structures.
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